公开(公告)号：US10040021B2

公开(公告)日：2018-08-07

申请号：US14593588

申请日：2015-01-09

Applicant: MEDTRONIC, INC.

Inventor： Andrew J. Ries ,  SuPing Lyu ,  Catherine M. Asgian ,  David Engmark ,  Ananta Pandey ,  Todd Schaefer ,  Erik Scott ,  Joachim Hossick-Schott

IPC: A61N1/375 ,  B01D53/04 ,  H01M2/10 ,  H01M10/42

Abstract: Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.

公开(公告)号：US20150196867A1

公开(公告)日：2015-07-16

申请号：US14593588

申请日：2015-01-09

Applicant: MEDTRONIC, INC.

Inventor： Andrew J. Ries ,  SuPing Lyu ,  Catherine M. Asgian ,  David Engmark ,  Ananta Pandey ,  Todd Schaefer ,  Erik Scott ,  Joachim Hossick-Schott

IPC: B01D53/04 ,  H01M10/42 ,  H01M2/10

CPC classification number: B01D53/0407 ,  A61N1/375 ,  A61N1/3758 ,  B01D2253/102 ,  B01D2253/1122 ,  B01D2253/202 ,  B01D2257/108 ,  B01D2257/80 ,  H01M2/1022 ,  H01M10/4264 ,  H01M2220/30 ,  Y10T29/49108

Abstract: Frame structures, assemblies and methods for use in implantable medical devices. The frames may include one or more first polymeric portions and one or more second polymeric portions coupled to the one or more first polymeric portions. The one or more first polymeric portions may have a higher durometer than the one or more second polymeric portions. The one or more second polymeric portions may provide an interference fit between the one or more second polymeric portions and the housing and/or between the one or more second polymeric portions and one or more components disposed in the housing.

Abstract translation: 用于可植入医疗器械的框架结构，组件和方法。 框架可以包括一个或多个第一聚合物部分和联接到一个或多个第一聚合物部分的一个或多个第二聚合物部分。 一个或多个第一聚合物部分可以具有比一个或多个第二聚合物部分更高的硬度。 一个或多个第二聚合物部分可以在一个或多个第二聚合物部分和壳体之间和/或在一个或多个第二聚合物部分和设置在壳体中的一个或多个部件之间提供过盈配合。