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公开(公告)号：US20240178929A1
公开(公告)日：2024-05-30
申请号：US18070840
申请日：2022-11-29
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Barak Gafni , Henning Lysdal
Abstract: A system including multiple processing devices such as application-specific integrated circuits (ASICs). Each processing device is provided with light at one or more wavelengths. Each processing device outputs data, at the wavelength of the optical signal received, to one or more interfaces. Each interface outputs a multiplexed signal containing data from each of the processing devices on a single optic fiber.
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公开(公告)号：US20250088300A1
公开(公告)日：2025-03-13
申请号：US18367970
申请日：2023-09-13
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Barak Gafni , Henning Lysdal
Abstract: A system for distributing individual wavelength signals to different destinations. The system includes three or more optical connectors, wherein fibers connected to the three or more optical connectors carry a plurality of wavelength signals. The system also includes a device that routes a first optical signal having a first wavelength from a first optical connector to a second optical connector.
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公开(公告)号：US20220276452A1
公开(公告)日：2022-09-01
申请号：US17649849
申请日：2022-02-03
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Henning Lysdal , Amir Silber , Nizan Meitav
IPC: G02B6/42
Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.
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Patent Agency Ranking
公开(公告)号：US20220283352A1
公开(公告)日：2022-09-08
申请号：US17195180
申请日：2021-03-08
Applicant: Mellanox Technologies, Ltd.
Inventor： Avner Badihi , Henning Lysdal
Abstract: Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.
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公开(公告)号：US12135461B2
公开(公告)日：2024-11-05
申请号：US17649849
申请日：2022-02-03
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Henning Lysdal , Amir Silber , Nizan Meitav
Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.
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公开(公告)号：US11768332B1
公开(公告)日：2023-09-26
申请号：US17867889
申请日：2022-07-19
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Henning Lysdal , Barak Gafni
IPC: G02B6/38
CPC classification number: G02B6/3831 , G02B6/3877
Abstract: An optical cable includes a single optical connector configured for insertion into an optical receptacle so as to receive optical signals at a plurality of different wavelengths from the optical receptacle, and multiple electrical connectors, configured for insertion into respective electrical receptacles. The optical cable further includes a plurality of optical fibers, having respective first ends connected together to the single optical connector so as to receive the optical signals. Each of the optical fibers has a respective second end coupled to a respective one of the electrical connectors. Each electrical connector includes a keyed portion to mate with an indentation on a transceiver.
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公开(公告)号：US11693169B2
公开(公告)日：2023-07-04
申请号：US17195180
申请日：2021-03-08
Applicant: Mellanox Technologies, Ltd.
Inventor： Avner Badihi , Henning Lysdal
CPC classification number: G02B6/002 , G02B6/0065 , H04J14/023
Abstract: Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.
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公开(公告)号：US20230139081A1
公开(公告)日：2023-05-04
申请号：US17518057
申请日：2021-11-03
Applicant: Mellanox Technologies Ltd.
Inventor： Tamar Viclizki , Vadim Gechman , Henning Lysdal , Shie Mannor
Abstract: System and method for detecting cable anomalies including collecting a first set cable measurement data. The first set of cable measurement data may be used to create a model including one or more groups based on the collected first set of cable measurement data. Collecting a second set of cable measurement data and determine a probability of anomaly for cable measurement data of the second set of cable measurement data, the probability of anomaly based on the deviation of the cable measurement data from one or more groups of the model.
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