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公开(公告)号:US20250089152A1
公开(公告)日:2025-03-13
申请号:US18367094
申请日:2023-09-12
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor: Yaniv Kazav , Yuval Ullman , Nimr Hazin , Jamal Mousa , Bar Noyman , Ayal Shabtay
Abstract: A pluggable network interface device includes a printed circuit board (“PCB”), a housing, and a heatsink. The heatsink includes a first surface and a second surface, disposed opposite the first surface, that is maintained in direct contact with a surface of a heat-generating circuit of the PCB. The housing includes an outer shell defining an exterior of the housing, a receiving cavity disposed inside the outer shell, and an aperture extending through a first side of the outer shell from the exterior of the housing into the receiving cavity. A portion of the PCB and the second surface of the heatsink are disposed inside the receiving cavity while a portion of the heatsink extends from within the receiving cavity through the aperture arranging the first surface of the heatsink adjacent the exterior of the housing.
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公开(公告)号:US20240126028A1
公开(公告)日:2024-04-18
申请号:US17967914
申请日:2022-10-18
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor: Jamal Mousa , Aziz Mazbar , Nimer Hazin , Alon Rokach , Ayal Shabtay , Yuval Ullman
CPC classification number: G02B6/4269 , G02B6/4236 , H04B10/40
Abstract: A transceiver includes, (a) a communication circuit, which is configured to exchange signals between a cable and a communication unit when the transceiver is connected to the communication unit, and (b) a housing, including: (i) a first shell including a substrate having the communication circuit disposed thereon, (ii) a second shell, which is configured to connect with the first shell for encapsulating the communication circuit, the second shell has an opening facing the communication circuit, and (iii) a base plate, which is fitted in the opening and including a first surface having one or more cooling fins formed thereon, and a second surface, opposite the first surface that is facing the communication circuit, the base plate is configured to transfer heat between the communication circuit and the cooling fins.
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