公开(公告)号：US12284783B2

公开(公告)日：2025-04-22

申请号：US17534645

申请日：2021-11-24

Applicant: Mellanox Technologies Ltd.

Inventor： Oren Weltsch ,  Rom Becker ,  Shay Zaretsky ,  Ayal Shabtay ,  Beeri Halachmi ,  Yuval Blayer ,  Kfir Katz ,  Yuval Dagan ,  Bar Noyman

IPC: H05K7/20 ,  G06F1/20

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

公开(公告)号：US20230137375A1

公开(公告)日：2023-05-04

申请号：US17517007

申请日：2021-11-02

Applicant: Mellanox Technologies Ltd.

Inventor： Ayal SHABTAY ,  Alon Rokach ,  Bar Noyman ,  Jamal Mousa ,  Nimer Hazin ,  Rom Becker

IPC: H05K7/20 ,  H01R13/66

Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.

公开(公告)号：US20250096509A1

公开(公告)日：2025-03-20

申请号：US18370748

申请日：2023-09-20

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Aziz Mazbar ,  Nimr Hazin ,  Andrey Ger ,  Jamal Mousa ,  Bar Noyman

IPC: H01R13/66 ,  H05K1/02

Abstract: A pluggable network interface device includes a printed circuit board (“PCB”) and a housing configured to receive a heat transfer plate selected from a set of swappable heat transfer plates. An upper surface of the housing includes a set of modular plate receiving features. When in an assembled state, the upper surface of the housing is attached via the set of modular plate receiving features to one heat transfer plate of a set of heat transfer plates. The overall height of the pluggable network interface module in the assembled state is greater than a first assembly height dimension measured from a base surface of the housing to the upper surface of the housing. The set of modular plate receiving features are configured to engage with any heat transfer plate in the set of swappable heat transfer plates that are associated with different module types.

公开(公告)号：US20250089152A1

公开(公告)日：2025-03-13

申请号：US18367094

申请日：2023-09-12

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Yaniv Kazav ,  Yuval Ullman ,  Nimr Hazin ,  Jamal Mousa ,  Bar Noyman ,  Ayal Shabtay

IPC: H05K1/02 ,  H05K5/00

Abstract: A pluggable network interface device includes a printed circuit board (“PCB”), a housing, and a heatsink. The heatsink includes a first surface and a second surface, disposed opposite the first surface, that is maintained in direct contact with a surface of a heat-generating circuit of the PCB. The housing includes an outer shell defining an exterior of the housing, a receiving cavity disposed inside the outer shell, and an aperture extending through a first side of the outer shell from the exterior of the housing into the receiving cavity. A portion of the PCB and the second surface of the heatsink are disposed inside the receiving cavity while a portion of the heatsink extends from within the receiving cavity through the aperture arranging the first surface of the heatsink adjacent the exterior of the housing.