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    Mechanical thermal interface for improved heat dissipation in network transceivers
    2.
    发明公开
    Mechanical thermal interface for improved heat dissipation in network transceivers 审中-公开

    公开(公告)号：US20240126028A1

    公开(公告)日：2024-04-18

    申请号：US17967914

    申请日：2022-10-18

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Jamal Mousa ,  Aziz Mazbar ,  Nimer Hazin ,  Alon Rokach ,  Ayal Shabtay ,  Yuval Ullman

    IPC: G02B6/42 ,  H04B10/40

    CPC classification number: G02B6/4269 ,  G02B6/4236 ,  H04B10/40

    Abstract: A transceiver includes, (a) a communication circuit, which is configured to exchange signals between a cable and a communication unit when the transceiver is connected to the communication unit, and (b) a housing, including: (i) a first shell including a substrate having the communication circuit disposed thereon, (ii) a second shell, which is configured to connect with the first shell for encapsulating the communication circuit, the second shell has an opening facing the communication circuit, and (iii) a base plate, which is fitted in the opening and including a first surface having one or more cooling fins formed thereon, and a second surface, opposite the first surface that is facing the communication circuit, the base plate is configured to transfer heat between the communication circuit and the cooling fins.

    DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERFACE DEVICES
    7.
    发明申请
    DIRECT CONTACT HEAT TRANSFER COUPLINGS FOR PLUGGABLE NETWORK INTERFACE DEVICES 有权

    公开(公告)号：US20250089152A1

    公开(公告)日：2025-03-13

    申请号：US18367094

    申请日：2023-09-12

    Applicant: MELLANOX TECHNOLOGIES, LTD.

    Inventor： Yaniv Kazav ,  Yuval Ullman ,  Nimr Hazin ,  Jamal Mousa ,  Bar Noyman ,  Ayal Shabtay

    IPC: H05K1/02 ,  H05K5/00

    Abstract: A pluggable network interface device includes a printed circuit board (“PCB”), a housing, and a heatsink. The heatsink includes a first surface and a second surface, disposed opposite the first surface, that is maintained in direct contact with a surface of a heat-generating circuit of the PCB. The housing includes an outer shell defining an exterior of the housing, a receiving cavity disposed inside the outer shell, and an aperture extending through a first side of the outer shell from the exterior of the housing into the receiving cavity. A portion of the PCB and the second surface of the heatsink are disposed inside the receiving cavity while a portion of the heatsink extends from within the receiving cavity through the aperture arranging the first surface of the heatsink adjacent the exterior of the housing.

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