Abstract:
A wiring apparatus includes a substrate, two winding modules, and an axial wire dividing module. The two winding modules are disposed on the substrate. Each winding module includes a clamping mechanism with a chuck, a rotary mechanism having a rotation driving unit driving the chuck; and a reciprocating mechanism with a rail-slider assembly, the rotation driving unit connected to the slider. The axial wire dividing module is disposed on the substrate and located between the two winding modules with a wire supply channel provided with a wire inlet and a wire outlet. The wire outlet is provided with a cutter aligned with the center of the wire supply channel, and a cutting edge of the cutter faces the wire inlet; a waveguide prototype mould is formed by dividing a wire in real time and winding wires in grooves of a waveguide prototype.