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公开(公告)号：US3239915A
公开(公告)日：1966-03-15
申请号：US13714861
申请日：1961-09-11
Applicant: METHODE ELECTRONICS INC
Inventor： MCGINLEY WILLIAM J , SPANNAGEL HOWARD G
CPC classification number: H05K3/041 , B26F1/40 , B29C70/58 , Y10T29/4916 , Y10T156/1054 , Y10T156/1313
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2.发明授权Apparatus for die-cutting and simultaneously adhesively securing foil circuit elements to a dielectric base 失效用于模切和同时将箔电路元件粘合地固定到电介质基底的装置
公开(公告)号：US3331726A
公开(公告)日：1967-07-18
申请号：US49690365
申请日：1965-10-18
Applicant: METHODE ELECTRONICS INC
Inventor： MCGINLEY WILLIAM J , SPANNAGEL HOWARD G
CPC classification number: B26F1/40 , B29C69/005 , H05K3/041 , H05K3/386 , H05K2203/0108 , Y10T156/12
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