Patent search ap:("METHODE ELECTRONICS INC") AND inv:"MCGINLEY WILLIAM J" Page 1

1.

发明授权
Apparatus for die-cutting and simultaneously adhesively securing foil circuit elements to a dielectric base 失效
Title translation: 用于模切和同时将箔电路元件粘合地固定到电介质基底的装置

公开(公告)号：US3331726A

公开(公告)日：1967-07-18

申请号：US49690365

申请日：1965-10-18

Applicant: METHODE ELECTRONICS INC

Inventor： MCGINLEY WILLIAM J , SPANNAGEL HOWARD G

IPC: B26F1/40 , B29C69/00 , H05K3/04 , H05K3/38

CPC classification number: B26F1/40 , B29C69/005 , H05K3/041 , H05K3/386 , H05K2203/0108 , Y10T156/12

2.

发明授权
Method of forming embossed electric circuits 失效
Title translation: 形成浮雕电路的方法

公开(公告)号：US3239915A

公开(公告)日：1966-03-15

申请号：US13714861

申请日：1961-09-11

Applicant: METHODE ELECTRONICS INC

Inventor： MCGINLEY WILLIAM J , SPANNAGEL HOWARD G

IPC: B26F1/40 , H05K3/04

CPC classification number: H05K3/041 , B26F1/40 , B29C70/58 , Y10T29/4916 , Y10T156/1054 , Y10T156/1313

3.

发明授权
Laminated socket with solder-well terminals 失效
Title translation: 带焊锡端子的层压插座

公开(公告)号：US3208034A

公开(公告)日：1965-09-21

申请号：US19814062

申请日：1962-05-28

Applicant: METHODE ELECTRONICS INC

Inventor： JENSEN WILLIAM T , MCGINLEY WILLIAM J

IPC: H01R33/76

CPC classification number: H01R33/7628

4.

发明授权
Weldable printed circuit making 失效
Title translation: 可焊接印刷电路制造

公开(公告)号：US3411205A

公开(公告)日：1968-11-19

申请号：US42846765

申请日：1965-01-27

Applicant: METHODE ELECTRONICS INC

Inventor： MCGINLEY WILLIAM J

IPC: H05K3/06 , H05K3/32 , H05K3/40 , H05K7/06

CPC classification number: H05K3/061 , H05K3/06 , H05K3/328 , H05K3/4092 , H05K7/06 , H05K2201/0355 , H05K2201/0382 , H05K2203/0522 , H05K2203/063 , H05K2203/1355 , Y10T29/49121 , Y10T29/49174

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