公开(公告)号：US20230331969A1

公开(公告)日：2023-10-19

申请号：US18023339

申请日：2021-08-30

Applicant: MITSUI CHEMICALS, INC.

Inventor： Shota ISHIHARA ,  Masakazu TANAKA ,  Toyoaki SASAKI

IPC: C08L23/20 ,  C08F210/14 ,  H01G4/18

CPC classification number: C08L23/20 ,  C08F210/14 ,  H01G4/18 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025

Abstract: The present invention provides a resin composition including a 4-methyl-1-pentene copolymer (A) that satisfies particular requirements and a 4-methyl-1-pentene copolymer (B) that satisfies particular requirements. The resin composition of the present invention can provide a smooth film with a small surface roughness and can be suitably used for molded articles such as films for capacitors, while containing the 4-methyl-1-pentene copolymers and having properties such as heat resistance. A film for capacitors of the present invention has a small surface roughness and is smooth, which eliminates problems such as worsening of dielectric properties and shortening of service life.