公开(公告)号：US20240383245A1

公开(公告)日：2024-11-21

申请号：US18785555

申请日：2024-07-26

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao NOGAMI ,  Akimitsu MORIMOTO

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

公开(公告)号：US20240343029A1

公开(公告)日：2024-10-17

申请号：US18753478

申请日：2024-06-25

Applicant: Mitsui Chemicals Tohcello, Inc.

Inventor： Masao NOGAMI ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US20220153009A1

公开(公告)日：2022-05-19

申请号：US17439238

申请日：2020-03-26

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao NOGAMI ,  Akimitsu MORIMOTO

IPC: B32B37/10 ,  H01L21/683 ,  B32B37/12 ,  C09J7/38

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US20240351323A1

公开(公告)日：2024-10-24

申请号：US18753590

申请日：2024-06-25

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao NOGAMI ,  Akimitsu Morimoto

IPC: B32B37/10 ,  B32B37/12 ,  H01L21/67 ,  H01L21/683

CPC classification number: B32B37/10 ,  B32B37/12 ,  H01L21/67092 ,  H01L21/6836

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

公开(公告)号：US20220157626A1

公开(公告)日：2022-05-19

申请号：US17439188

申请日：2020-03-26

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Masao NOGAMI ,  Akimitsu MORIMOTO

IPC: H01L21/67

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.