公开(公告)号：US20230111798A1

公开(公告)日：2023-04-13

申请号：US17959502

申请日：2022-10-04

Applicant: MK ELECTRON CO., LTD.

Inventor： Young Woo LEE ,  Seul Gi LEE ,  Hui Joong KIM ,  Jae Yool SON ,  Jae Hun SONG ,  Jeong Tak MOON

IPC: B23K35/26 ,  C22C13/02

Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.