公开(公告)号：US20230111798A1

公开(公告)日：2023-04-13

申请号：US17959502

申请日：2022-10-04

Applicant: MK ELECTRON CO., LTD.

Inventor： Young Woo LEE ,  Seul Gi LEE ,  Hui Joong KIM ,  Jae Yool SON ,  Jae Hun SONG ,  Jeong Tak MOON

IPC: B23K35/26 ,  C22C13/02

Abstract: A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.

公开(公告)号：US20220212293A1

公开(公告)日：2022-07-07

申请号：US17558989

申请日：2021-12-22

Applicant: MK ELECTRON CO., LTD.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Seul Gi LEE ,  Min Su PARK ,  Hui Joong KIM

IPC: B23K35/26 ,  B23K35/02

Abstract: A lead (Pb)-free, and silver (Ag)-free solder alloy includes a primary metallic element in a content of about 1.1 wt % to about 1.9 wt %, nickel(Ni) in a content of about 0.02 wt % to about 0.09 wt %, copper (Cu) in a content of about 0.2 wt % to about 0.9 wt %, and tin (Sn) and other unavoidable impurities in remaining balance, wherein the primary metallic element is at least one selected from the group including bismuth (Bi), chromium (Cr), indium (In), antimony (Sb), silicon (Si) and zinc (Zn).

公开(公告)号：US20210366858A1

公开(公告)日：2021-11-25

申请号：US17323705

申请日：2021-05-18

Applicant: MK ELECTRON CO., LTD.

Inventor： Jae Yeol SON ,  Jeong Tak MOON ,  Jae Hun SONG ,  Young Woo LEE ,  Seul Gi LEE ,  Min Su PARK ,  Hui Joong KIM

IPC: H01L23/00

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.