公开(公告)号：US20210195341A1

公开(公告)日：2021-06-24

申请号：US16725980

申请日：2019-12-23

Applicant: MOTOROLA SOLUTIONS, INC.

Inventor： ANDREW P. MIEHL ,  DEBORAH A. GRUENHAGEN ,  GENG XIANG LEE ,  KARL F. MUELLER

IPC: H04R19/04 ,  H04R1/04 ,  H04R29/00

Abstract: Methods and systems for verification of an environmental seal provided by an encapsulant coating of a bottom-ported MEMS microphone package. A purposeful acoustic leak is provided on an upper surface of a package housing (in the form of an additional acoustic port) and a sealing material is applied to an outer surface of the package housing. A properly applied encapsulant coating will completely seal the additional acoustic port on the upper surface of the package housing. However, the placement of the additional acoustic port on the upper surface of the package housing will have a significant, detectable effect on the frequency response of the microphone if it is not completely sealed by the encapsulant coating. Accordingly, the environmental seal provided by the encapsulant coating is verified by confirming, based on the acoustic frequency response testing, that the encapsulant coating has effectively sealed the additional acoustic port on the upper surface of the package housing.

公开(公告)号：US20170111751A1

公开(公告)日：2017-04-20

申请号：US14885928

申请日：2015-10-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： ANDREW P. MIEHL ,  PATRICK S. CLAEYS ,  KARL F. MUELLER

IPC: H04R31/00 ,  B81B7/00

CPC classification number: H04R31/006 ,  B81B7/0061 ,  B81B2201/0257 ,  H04R1/342 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2201/401 ,  H04R2499/11

Abstract: A microphone porting structure, comprises a substrate (312) having a bearing surface and a porting through-hole (344) formed therethough for aligning with a microphone port of a bottom ported microphone (334). The bearing surface provides an area against which to seal and the through-hole provides for acoustic path alignment for the audio ports of paired bottom ported microphones mounted to a printed circuit board.