公开(公告)号：US20230251305A1

公开(公告)日：2023-08-10

申请号：US17608632

申请日：2020-12-30

申请人： MSV SYSTEMS & SERVICES PTE LTD

发明人： Teck Huat TAN ,  Chun Hong LOW

IPC分类号： G01R31/28

CPC分类号： G01R31/2867 ,  G01R31/2862 ,  G01R31/2863 ,  G01R31/287

摘要： The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises of a burn-in chamber with an incomplete base which is adapted to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is adapted to be removably moved into and docked in the burn-in chamber to complete the burn-in apparatus. The burn-in apparatus comprises the burn-in chamber and at least one frame. The apparatus is complete and thermally insulated when the frame is moved into the burn-in chamber and docked therein. The apparatus is incomplete and thermally uninsulated when the frame is moved out of the burn-in chamber and undocked therefrom.