公开(公告)号：US20140134338A1

公开(公告)日：2014-05-15

申请号：US14159153

申请日：2014-01-20

Applicant: MacDermid Acumen, Inc.

Inventor： Roshan V. Chapaneri ,  Anthony Wall ,  Trevor Pearson ,  Roderick D. Herdman

IPC: C23C22/73

CPC classification number: C23C22/73 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/30 ,  C23C18/32

Abstract: A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.

Abstract translation: 公开了一种在不使用含铬蚀刻剂的情况下将金属镀在塑料基材，特别是ABS基材上的方法。 该方法包括（i）在硝酸根离子的酸性溶液中蚀刻塑料基底，优选银离子，（ii）在含胺或氨的水溶液中调理底物，（iii）活化底物，优选用钯 活化剂，和（iv）用化学镀溶液电镀基材。 该方法允许塑料基材，特别是ABS基材的完全粘附无电镀，而不使用铬蚀刻剂。