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    Regeneration of etch solutions containing trivalent manganese in acid media
    1.
    发明授权
    Regeneration of etch solutions containing trivalent manganese in acid media 有权

    公开(公告)号：US10882756B2

    公开(公告)日：2021-01-05

    申请号：US16800186

    申请日：2020-02-25

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roderick D. Herdman

    IPC: C25B1/21 ,  C01G45/02 ,  C09K13/04 ,  H05K3/38

    Abstract: A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.

    Treatment of Etch Baths
    2.
    发明申请
    Treatment of Etch Baths 审中-公开

    公开(公告)号：US20170088971A1

    公开(公告)日：2017-03-30

    申请号：US14870738

    申请日：2015-09-30

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roderick D. Herdman ,  Trevor Pearson ,  Roshan V. Chapaneri

    IPC: C25D21/18 ,  C25D5/56

    CPC classification number: C25D21/18 ,  C23C18/24 ,  C25D5/56

    Abstract: A method of maintaining a concentration of sulfuric acid in an electrolyte comprising manganese(III) ions in a solution of sulfuric acid. The method includes the steps of a) removing a portion of the electrolyte from the electrolytic cell to an annex tank; b) treating the removed portion of the electrolyte in the annex tank to remove moisture from the portion of the electrolyte; and c) returning the treated portion of the electrolyte to the electrolytic cell. The removed portion of the electrolyte is treated by passing a dry gas over the surface of the electrolyte in the annex tank to absorb moisture from the electrolyte and restore the concentration of sulfuric acid in the electrolyte.

    Treatment for Electroplating Racks to Avoid Rack Metallization
    3.
    发明申请
    Treatment for Electroplating Racks to Avoid Rack Metallization 审中-公开
    电镀架的处理以避免机架金属化

    公开(公告)号：US20150233011A1

    公开(公告)日：2015-08-20

    申请号：US14184011

    申请日：2014-02-19

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roderick D. Herdman ,  Roshan V. Chapaneri ,  Alison Hyslop

    IPC: C25D17/08 ,  C23C28/00

    CPC classification number: C25D17/08 ,  C23C18/163

    Abstract: An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.

    Abstract translation: 描述了一种用于在电沉积工艺期间支撑非导电衬底的电镀架。 电镀机架涂有非导电材料，如PVC增塑溶胶。 在电沉积过程之前，用包含金属化抑制剂的非水溶液处理电镀架，以在使用不含铬酸的蚀刻剂时抑制齿条板的上升。

    Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
    4.
    发明申请
    Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media 审中-公开
    含硝酸介质中蚀刻后的塑料表面处理

    公开(公告)号：US20140134338A1

    公开(公告)日：2014-05-15

    申请号：US14159153

    申请日：2014-01-20

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roshan V. Chapaneri ,  Anthony Wall ,  Trevor Pearson ,  Roderick D. Herdman

    IPC: C23C22/73

    CPC classification number: C23C22/73 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/30 ,  C23C18/32

    Abstract: A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.

    Abstract translation: 公开了一种在不使用含铬蚀刻剂的情况下将金属镀在塑料基材，特别是ABS基材上的方法。 该方法包括（i）在硝酸根离子的酸性溶液中蚀刻塑料基底，优选银离子，（ii）在含胺或氨的水溶液中调理底物，（iii）活化底物，优选用钯 活化剂，和（iv）用化学镀溶液电镀基材。 该方法允许塑料基材，特别是ABS基材的完全粘附无电镀，而不使用铬蚀刻剂。

    Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching
    5.
    发明申请
    Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching 审中-公开
    有机盐作为蚀刻前塑料预处理的解决方案

    公开(公告)号：US20170051410A1

    公开(公告)日：2017-02-23

    申请号：US14831266

    申请日：2015-08-20

    Applicant: MacDermid Acumen, Inc.

    Inventor： Trevor Pearson ,  Craig Robinson ,  Roderick D. Herdman

    IPC: C23C18/20 ,  C23C18/24

    CPC classification number: C23C18/2086 ,  C23C18/22 ,  C23C18/24

    Abstract: A method of preparing a plastic substrate to accept metal plating thereon is described. The method includes the steps of pretreating the plastic substrate by contacting the plastic substrate with an aqueous electrolyte comprising an organic salt to raise the surface energy of the plastic substrate. Thereafter, the plastic substrate can be etched and metal plated.

    Abstract translation: 描述了制备塑料基板以在其上接受金属电镀的方法。 该方法包括以下步骤：通过使塑料基材与包含有机盐的含水电解质接触以提高塑料基材的表面能来预处理塑料基材。 此后，可以蚀刻塑料基板并进行金属电镀。

    Passivation of Micro-Discontinuous Chromium Deposited From a Trivalent Electrolyte
    6.
    发明申请
    Passivation of Micro-Discontinuous Chromium Deposited From a Trivalent Electrolyte 有权
    从三价电解质沉积的微不连续铬的钝化

    公开(公告)号：US20150252487A1

    公开(公告)日：2015-09-10

    申请号：US14200546

    申请日：2014-03-07

    Applicant: MacDermid Acumen, Inc.

    Inventor： Marc Mertens ,  Richard Tooth ,  Trevor Pearson ,  Roderick D. Herdman ,  Terence Clarke

    IPC: C25D3/06

    CPC classification number: C25D3/06 ,  C25D5/48 ,  C25D9/08 ,  Y10T428/12854

    Abstract: A method of treating a substrate, wherein the substrate comprises a layer deposited from a trivalent chromium electrolyte, is described. The method includes the steps of providing an anode and the chromium(III) plated substrate as a cathode in an electrolyte comprising (i) a trivalent chromium salt; and (ii) a complexant; and passing an electrical current between the anode and the cathode to passivate the chromium(III) plated substrate. The substrate may be first plated with a plated nickel layer so that the chromium(III) plated layer is deposited over the nickel plated layer.

    Abstract translation: 描述了一种处理衬底的方法，其中衬底包括由三价铬电解质沉积的层。 该方法包括以下步骤：在电解质中提供阳极和镀有铬（III）的底物作为阴极，其包括（i）三价铬盐; 和（ii）复合物; 并在阳极和阴极之间通过电流以钝化镀铬（III）的衬底。 可以首先将衬底镀覆镀镍层，以使镀铬层（III）沉积在镀镍层上。

    Treatment for Electroplating Racks to Avoid Rack Metallization
    9.
    发明申请
    Treatment for Electroplating Racks to Avoid Rack Metallization 有权
    电镀架的处理以避免机架金属化

    公开(公告)号：US20160040315A1

    公开(公告)日：2016-02-11

    申请号：US14454131

    申请日：2014-08-07

    Applicant: MacDermid Acumen, Inc.

    Inventor： Roderick D. Herdman ,  Trevor Pearson ,  Roshan V. Chapaneri ,  Alison Hyslop

    IPC: C25D17/08 ,  C25D5/34 ,  C09D181/00

    CPC classification number: C25D17/08 ,  C09D181/00 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C25D5/34

    Abstract: A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive having the structure: wherein R, R′, R″ and R′″ are either the same or are independently selected from the group consisting of benzyl, substituted benzyl, phenyl or substituted phenyl; or wherein R, R′, R″ and R′″ are either the same or are independently selected from C1-C10 alkyl (either straight or branched chain), benzyl, substituted benzyl, phenyl, or substituted phenyl and M is a divalent metal cation, preferably selected from the group consisting of nickel, copper and zinc; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

    Abstract translation: 一种在电镀工艺期间涂覆用于支撑非导电衬底的电镀架的方法。 该方法包括以下步骤：使电镀架的至少一部分与增塑溶胶组合物接触，增塑溶胶组合物中分散有有效量的具有以下结构的添加剂：其中R，R'，R“和R” 相同或独立地选自苄基，取代的苄基，苯基或取代的苯基; 或其中R，R'，R“和R”“相同或独立地选自C 1 -C 10烷基（直链或支链），苄基，取代的苄基，苯基或取代的苯基，M是二价金属 阳离子，优选选自镍，铜和锌; 并将其上的增塑溶胶组合物的电镀架加热到合适的温度并持续足够的时间固化增塑溶胶并在电镀架上形成固体绝缘涂层。 然后可以将涂覆的电镀机架用于安装非导电衬底以用于随后的金属化步骤。

    Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media
    10.
    发明申请
    Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media 审中-公开
    酸性介质中含有三价锰的蚀刻溶液的再生

    公开(公告)号：US20140318983A1

    公开(公告)日：2014-10-30

    申请号：US13870232

    申请日：2013-04-25

    Applicant: MACDERMID ACUMEN, INC.

    Inventor： Roderick D. Herdman

    IPC: C09K13/00

    CPC classification number: C01G45/02 ,  C09K13/04 ,  C25B1/21 ,  H05K3/381

    Abstract: A method of regenerating an etch solution comprising a metastable complex of manganese(III) ions in a strong acid is described in which at least a portion of the manganese(III) ions in the metastable complex have been destabilized, causing them to disproportionate into manganese dioxide and manganese(II) ions. The method includes the steps of i) adding an effective amount of a reducing agent to the solution; ii) allowing the reducing agent to react with the solution to cause manganese dioxide to dissolve; and (iii) applying an electrical current to regenerate manganese(III) ions in the solution.

    Abstract translation: 描述了在强酸中再生包含锰（III）离子的亚稳态复合物的蚀刻溶液的方法，其中亚稳态络合物中的至少一部分锰（III）离子已经不稳定，导致它们不成比例地变成锰 二氧化锰和锰（II）离子。 该方法包括以下步骤：i）向溶液中加入有效量的还原剂; ii）使还原剂与溶液反应，使二氧化锰溶解; 和（iii）施加电流以再生溶液中的锰（III）离子。

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