公开(公告)号：US20250137157A1

公开(公告)日：2025-05-01

申请号：US18836526

申请日：2023-04-04

Applicant: MacDermid Enthone Inc.

Inventor： Hermine Marie BERTHON ,  Mikailou THIAM ,  Louis CAILLARD ,  Yeeseul KIM

IPC: C25D3/38 ,  C25D5/02 ,  C25D7/12

Abstract: The present invention is directed to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of two aromatic amines, a complexing agent for copper (II) ions, and an accelerator such as dithiodiglycolic acid, thioglycolic acid, thiourea, ammonium thiocyanate, thiocyanic acid, or combinations of the foregoing. The invention is also directed to a process for creating copper interconnects comprising a step of electroplating copper with said electrolyte into cavities. The electrolyte makes it possible to manufacture copper interconnects with an improved bottom-up effect during the copper filling electroplating step.

公开(公告)号：US20250137140A1

公开(公告)日：2025-05-01

申请号：US18836481

申请日：2023-03-30

Applicant: MacDermid Enthone Inc.

Inventor： Vincent MEVELLEC ,  Yeeseul KIM ,  Louis CAILLARD

IPC: C23C18/18 ,  C23C18/50

Abstract: A method of metallizing a dielectric substrate with a nickel-boron alloy or cobalt-boron alloy to deposit a thin layer of the alloy that exhibits good conductivity. The process includes an activation step that includes two stages of activation with a noble metal such as palladium. Thereafter, the dielectric substrate is metallized with a nickel-boron or cobalt-boron alloy by electroless deposition.