公开(公告)号：US09305840B2

公开(公告)日：2016-04-05

申请号：US14138038

申请日：2013-12-21

Applicant: Macronix International Co., Ltd.

Inventor： Hsu-Sheng Yu ,  Hong-Ji Lee ,  N. T. Lian ,  T. H. Yang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L21/67

CPC classification number: H01L21/76879 ,  H01L21/67207 ,  H01L21/76843 ,  H01L21/76865 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53266 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cluster tool is disclosed that can increase throughput of a wafer fabrication process by facilitating removal of barrier overhang in contact holes of contact film stacks. Individual chambers of the cluster tool provide for deposition of barrier material onto a semiconductor structure, depositing over with an amorphous carbon film (ACF), etching back the ACF, and etching a corner region of the contact hole. Removal of the barrier overhang improves the quality of metal fill-in of the contact hole. An expectedly ensuing feature entails a technique in which filling-in of the contact hole with a metal such as tungsten can be achieved with attenuated or eliminated adverse consequence.

Abstract translation: 公开了一种集群工具，其可以通过有助于去除接触膜堆叠的接触孔中的阻挡突出部来增加晶片制造工艺的生产量。 集群工具的单个室提供阻挡材料沉积到半导体结构上，用无定形碳膜（ACF）沉积，对ACF进行蚀刻，并蚀刻接触孔的拐角区域。 阻挡突出部的移除提高了接触孔的金属填充质量。 预期的随后特征需要一种技术，其中可以通过减弱或消除不利后果来实现用诸如钨的金属填充接触孔。