Electrically Conductive Metal Fluid Distribution Plate for Fuel Cells
    6.
    发明申请
    Electrically Conductive Metal Fluid Distribution Plate for Fuel Cells 有权
    用于燃料电池的导电金属流体分配板

    公开(公告)号:US20110311720A1

    公开(公告)日:2011-12-22

    申请号:US13222162

    申请日:2011-08-31

    IPC分类号: B05D5/12

    摘要: In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.

    摘要翻译: 在至少一个实施例中,本发明提供了一种导电流体分配板以及用于制造导电流体分布板和使用该系统的方法。 在至少一个实施例中,板包括导电流体分配板,该导电流体分配板包括金属板体,其限定一组流体流动通道,所述一组流体流动通道被配置成分配流体流过板的至少一侧,含金属的粘附促进层 具有设置在板体上的厚度小于100nm的复合聚合物导电层和设置在含金属的粘附促进层上的复合聚合物导电层。

    Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
    8.
    发明授权
    Metal fluid distribution plate with an adhesion promoting layer and polymeric layer 有权
    金属流体分布板,具有粘附促进层和聚合物层

    公开(公告)号:US08247138B2

    公开(公告)日:2012-08-21

    申请号:US13222162

    申请日:2011-08-31

    IPC分类号: H01M4/86

    摘要: In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.

    摘要翻译: 在至少一个实施例中,本发明提供了一种导电流体分配板以及用于制造导电流体分布板和使用该系统的方法。 在至少一个实施例中,板包括导电流体分配板,该导电流体分配板包括金属板体,其限定一组流体流动通道,所述一组流体流动通道被配置成分配流体流过板的至少一侧,含金属的粘附促进层 具有设置在板体上的厚度小于100nm的复合聚合物导电层和设置在含金属的粘附促进层上的复合聚合物导电层。

    Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
    9.
    发明授权
    Metal fluid distribution plate with an adhesion promoting layer and polymeric layer 有权
    金属流体分布板,具有粘附促进层和聚合物层

    公开(公告)号:US08017280B2

    公开(公告)日:2011-09-13

    申请号:US11180467

    申请日:2005-07-13

    IPC分类号: H01M4/86

    摘要: In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.

    摘要翻译: 在至少一个实施例中,本发明提供了一种导电流体分配板以及用于制造导电流体分布板和使用该系统的方法。 在至少一个实施例中,板包括导电流体分配板,该导电流体分配板包括金属板体,其限定一组流体流动通道,所述一组流体流动通道被配置成分配流体流过板的至少一侧,含金属的粘附促进层 具有设置在板体上的厚度小于100nm的复合聚合物导电层和设置在含金属的粘附促进层上的复合聚合物导电层。