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公开(公告)号：US20120057371A1
公开(公告)日：2012-03-08
申请号：US13146444
申请日：2011-02-17
CPC分类号： F21V29/70 , F21K9/23 , F21K9/232 , F21V3/00 , F21V17/005 , F21V19/004 , F21Y2105/10 , F21Y2115/10
摘要： A lamp capable of suppressing an increase in a temperature of semiconductor light-emitting devices such as LED is provided. The lamp includes an LED module (11) which is a light source, a radiator (14) thermally coupled to the light source, a lighting circuit (13) for turning the lighting source on and is housed in the radiator (14), and a base (12) for supplying power to the lighting circuit (13), and the radiator (14) includes a heat sink (15) covering the lighting circuit (13) and a light source attachment (16) to which the light source is placed. Furthermore, a convex (16b) of an end portion of the light source attachment (16) is fit into a recess (15c) of the heat sink (15).
摘要翻译： 提供了能够抑制LED等半导体发光装置的温度上升的灯。 该灯包括作为光源的LED模块（11），与光源热耦合的散热器（14），用于将照明源转接并放置在散热器（14）中的照明电路（13），以及 用于向所述照明电路（13）供电的基座（12），所述散热器（14）包括覆盖所述点亮电路（13）的散热片（15）和光源附件 放置 此外，光源附件（16）的端部的凸部（16b）装配到散热器（15）的凹部（15c）中。
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公开(公告)号：US08322898B2
公开(公告)日：2012-12-04
申请号：US13222373
申请日：2011-08-31
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V15/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译： 一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。 照明电路经由基座部件接收电力。 照明电路设置在电路保持器内。 在电路架与壳体和安装构件之间存在空气空间。 照明电路由电路座与空气空间隔离。 满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积 模块。
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公开(公告)号：US20120002421A1
公开(公告)日：2012-01-05
申请号：US13222373
申请日：2011-08-31
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译： 一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。 照明电路经由基座部件接收电力。 照明电路设置在电路保持器内。 在电路架与壳体和安装构件之间存在空气空间。 照明电路由电路座与空气空间隔离。 满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积 模块。
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公开(公告)号：US08038329B2
公开(公告)日：2011-10-18
申请号：US12994741
申请日：2010-02-03
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V29/00
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译： 一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。 照明电路经由基座部件接收电力。 照明电路设置在电路保持器内。 在电路架与壳体和安装构件之间存在空气空间。 照明电路由电路座与空气空间隔离。 在S1表示与壳体接触的安装构件的一部分的面积，S2表示与LED模块的基板接触的安装构件的部分的面积的情况下，满足关系0.5＆nlE; S1 / S2。
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公开(公告)号：US09080757B2
公开(公告)日：2015-07-14
申请号：US13565652
申请日：2012-08-02
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： F21V29/00 , F21V23/00 , F21K99/00 , F21V3/00 , F21V29/15 , F21V29/83 , F21V29/89 , F21S8/02 , F21Y101/02
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
摘要翻译： 一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡型灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。 照明电路经由基座部件接收电力。 照明电路设置在电路保持器内。 在电路架与壳体和安装构件之间存在空气空间。 照明电路由电路座与空气空间隔离。 满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积 模块。
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公开(公告)号：US20120300448A1
公开(公告)日：2012-11-29
申请号：US13565652
申请日：2012-08-02
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.
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公开(公告)号：US20110068687A1
公开(公告)日：2011-03-24
申请号：US12994741
申请日：2010-02-03
申请人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
发明人： Kenzi Takahasi , Yasushige Tomiyoshi , Takaari Uemoto , Hideo Nagai , Mamoru Takeda , Yoshio Manabe
IPC分类号： H01J13/46
CPC分类号： F21V23/009 , F21K9/23 , F21K9/233 , F21S8/026 , F21V3/00 , F21V23/002 , F21V29/15 , F21V29/83 , F21V29/89 , F21Y2115/10
摘要： [Problem to be Solved] To provide a bulb-type lamp that can achieve improvement in the heat dissipation properties and size/weight reduction simultaneously, and that can lighten thermal load on a lighting circuit.[Solution] A bulb-type lamp 1 is composed of: an LED module 3 including LEDs; a cylindrically-shaped case 7, to one end of which a base member 15 is attached and which allows dissipation of heat therefrom, the heat being generated by the LEDs emitting light; a mount member 5, on which the LED module 3 is mounted, which closes the other end of the case 7, and allows conduction of the heat to the case 7; a lighting circuit 11 that, upon receiving power via the base member 15, causes the LEDs to emit light; and a circuit holder 13 positioned inside the case 7, with the lighting circuit 11 disposed inside the circuit holder 13. The air space exists between the circuit holder 13 and the case7, and between the circuit holder 13 and the mount member 5. Hence, the lighting circuit 11 is isolated from the air space due to the presence of the circuit holder 13. In the bulb-type lamp 1, a fraction S1/S2 satisfies a relationship 0.5≦S1/S2, where S1 denotes an area of a portion of the mount member 5 that is in contact with the case 7, and S2 denotes an area of a portion of the mount member 5 that is in contact with a substrate 17 of the LED module 3.
摘要翻译： [待解决的问题]提供一种能够同时实现散热特性和尺寸/重量减轻的灯泡型灯，并且可以减轻照明电路上的热负荷。 [解决方案]灯泡型灯1包括：包括LED的LED模块3; 圆柱形壳体7，其一端安装有基座构件15，并且允许散热，由发光的LED产生的热量; 安装有LED模块3的安装构件5，其封闭壳体7的另一端，并且允许热量传导到壳体7; 照明电路11，其经由基部构件15接收电力使得LED发光; 以及位于壳体7内部的电路保持器13，其中照明电路11设置在电路保持器13的内部。电路保持器13和壳体7之间以及电路保持器13和安装构件5之间存在空气空间。因此， 照明电路11由于电路保持器13的存在而与空气空间隔离。在灯泡型灯1中，分数S1 / S2满足关系0.5＆nlE; S1 / S2，其中S1表示 与壳体7接触的安装部件5的部分，S2表示与LED模块3的基板17接触的安装部件5的一部分的面积。
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公开(公告)号：US20120127733A1
公开(公告)日：2012-05-24
申请号：US13376366
申请日：2010-06-09
IPC分类号： F21V3/00
CPC分类号： F21V3/02 , F21K9/23 , F21V17/101 , F21V17/104 , F21V19/0055 , F21V23/002 , F21Y2105/10 , F21Y2115/10
摘要： A compact LED lamp (1) is provided with a holder (20), an LED module (10) mounted on the holder (20), and a globe (70) covering the LED module (10). The holder (20) has a groove (21) surrounding the LED module (10) at a top surface (24a) of the holder (20), with a rim (70a) of the globe (70) inserted in the groove (21). When comparing an edge (D1) and an edge (D2) along a side wall (24c) of the groove (21), the edge (D1) is closer to an opening of the groove, and the edge (D2) is closer to a bottom of the groove. The edge (D2) is more recessed than the edge (D1) in a direction perpendicular to a direction of depth of the groove. Furthermore, the groove (21) has through-holes (22) at part of a bottom surface (24d) of the groove (21) to connect to a back surface (24b) of the holder (20). The groove (21) and the through-holes (22) are filled with adhesive (80).
摘要翻译： 紧凑型LED灯（1）设置有保持器（20），安装在保持器（20）上的LED模块（10）和覆盖LED模块（10）的灯罩（70）。 所述保持器（20）在所述保持器（20）的顶表面（24a）处具有围绕所述LED模块（10）的凹槽（21），所述球状体（70）的边缘（70a）插入所述凹槽 ）。 当沿凹槽（21）的侧壁（24c）比较边缘（D1）和边缘（D2）时，边缘（D1）更靠近凹槽的开口，并且边缘（D2）更靠近 凹槽的底部。 边缘（D2）在与凹槽的深度方向垂直的方向上比边缘（D1）更凹下。 此外，凹槽（21）在凹槽（21）的底表面（24d）的一部分处具有连接到保持器（20）的后表面（24b）的通孔（22）。 槽（21）和通孔（22）填充有粘合剂（80）。
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公开(公告)号：USD644763S1
公开(公告)日：2011-09-06
申请号：US29382717
申请日：2011-01-06
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公开(公告)号：USD644760S1
公开(公告)日：2011-09-06
申请号：US29380088
申请日：2010-11-30
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