公开(公告)号：US20080083548A1

公开(公告)日：2008-04-10

申请号：US11868204

申请日：2007-10-05

申请人： Makoto NAKAYAMA ,  Masahiro Kanamaru

发明人： Makoto NAKAYAMA ,  Masahiro Kanamaru

IPC分类号： H02G3/08

CPC分类号： H05K5/0204

摘要： Provided is a structure for housing an electrical junction box in a housing box by inserting the electrical junction box into the housing box from above and also for fixing the electrical junction box to the housing box so as to prevent slipping-off thereof by engagement between engagement parts provided on external side surfaces of the electrical junction box and engagement parts provided on internal side surfaces of the housing box, both of which face each other in parallel with an insertion direction in insertion of the electrical junction box. Moreover, groove-like depressions extended along the insertion direction into the housing box are provided in the external side surfaces of the electrical junction box, and engagement convex parts are provided in the depressions. Furthermore, engagement projections engaged with the engagement convex parts are provided on the internal side surfaces of the housing box. As depressions behind the engagement convex parts in the insertion direction, die-releasing holes for injection molding for forming locking parts of the electrical junction box are used.

摘要翻译： 提供一种用于通过将电接线盒从上方插入到外壳中并且还将电接线盒固定到外壳盒以将电接线盒容纳在外壳中的结构，以防止通过接合之间的接合而滑脱 设置在电接线盒的外侧表面上的部件和设置在壳体的内侧表面上的接合部分，两者在插入电接线盒时彼此面向插入方向彼此平行。 此外，在电接线盒的外侧表面设置有沿着插入方向延伸到壳体中的槽状凹部，并且在凹部中设置接合凸部。 此外，与接合凸部接合的接合突起设置在容纳箱的内侧表面上。 作为插入方向上的接合凸部的凹部，使用用于形成电接线盒的锁定部的注射成型用的模具释放孔。

公开(公告)号：US20090200298A1

公开(公告)日：2009-08-13

申请号：US12361571

申请日：2009-01-29

申请人： Makoto NAKAYAMA ,  Shinichi HAMAGUCHI

发明人： Makoto NAKAYAMA ,  Shinichi HAMAGUCHI

IPC分类号： H02G3/08

CPC分类号： H02G3/081

摘要： A box includes a first cover, a second cover, and an interior component housed in an internal space formed when the first cover and second cover are fit to each other. The first cover and the second cover have engaging mechanisms which engage the one end of the first cover to the one end of the second cover, and have retaining mechanisms which retain the other end of the first cover to the other end of the second cover. The first cover and the second cover are fit to each other in a normal state in a case that the engaging mechanisms are engaged with each other in a state where the retaining mechanisms are normally retained to each other. A projection is provided on at least one of the one end of the first cover and the one end of the second cover. When an engagement between the engaging mechanisms is in an abnormal state, the projection abuts against at least the other of the one end of the first cover and the one end of the second cover so that a gap between the one end of the first cover and the one end of the second cover is assured and the interior component housed in the internal space can be seen through the gap.

摘要翻译： 盒包括第一盖，第二盖和容纳在第一盖和第二盖彼此配合形成的内部空间中的内部部件。 第一盖和第二盖具有接合机构，其将第一盖的一端接合到第二盖的一端，并且具有将第一盖的另一端保持到第二盖的另一端的保持机构。 在保持机构相互保持的状态下，接合机构彼此接合的情况下，第一盖和第二盖在正常状态下彼此配合。 在第一盖的一端和第二盖的一端中的至少一个上设置有突起。 当接合机构之间的接合处于异常状态时，突出部至少抵靠第一盖的一端和第二盖的一端中的另一端，使得第一盖的一端和 确保第二盖的一端，并且可以通过间隙看到容纳在内部空间中的内部部件。

公开(公告)号：US20100148307A1

公开(公告)日：2010-06-17

申请号：US12707121

申请日：2010-02-17

申请人： Masayuki FURUMIYA ,  Kuniko KIKUTA ,  Ryota YAMAMOTO ,  Makoto NAKAYAMA

发明人： Masayuki FURUMIYA ,  Kuniko KIKUTA ,  Ryota YAMAMOTO ,  Makoto NAKAYAMA

IPC分类号： H01L29/92

CPC分类号： H01L23/5223 ,  H01L27/0805 ,  H01L28/87 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

摘要翻译： 半导体器件具有形成在半导体器件上的半导体衬底，多层布线结构以及在多层布线结构中建立的金属 - 绝缘体 - 金属（MIM）电容器布置。 MIM电容器装置包括以规则的间隔彼此平行地排列的第一，第二，第三，第四，第五和第六电极结构。 第一，第二，第五和第六电极结构彼此电连接以限定第一电容器，并且第三和第四电极结构彼此电连接以限定第二电容器。

公开(公告)号：US20070148825A1

公开(公告)日：2007-06-28

申请号：US11681850

申请日：2007-03-05

申请人： Kuniko KIKUTA ,  Makoto NAKAYAMA

发明人： Kuniko KIKUTA ,  Makoto NAKAYAMA

IPC分类号： H01L21/00

CPC分类号： H01L27/016 ,  H01L23/5223 ,  H01L28/55 ,  H01L2924/0002 ,  Y10S257/923 ,  Y10S257/924 ,  H01L2924/00

摘要： A lower interconnection is provided on a semiconductor substrate. A MIM capacitive element is provided on a first interlayer insulation film in which the lower interconnection is buried, and includes a lower electrode, an upper electrode, and a dielectric film sandwiched therebetween. An upper interconnection is provided on a second interlayer insulation film in which the MIM capacitive element is buried. A contact electrically connects the lower electrode and the upper interconnection. The lower electrode is mainly formed of Al, so that they are lower in electrical resistance than barrier metal, and also low in stress value. Therefore, it becomes possible to widen the area of the lower electrode for electrically connecting the contact while restraining their influences on charge accumulation and close contact between the lower electrode and the insulation film. In addition, since the electrical resistance is lowered, the thickness of the lower electrode can be increased. Accordingly, the MIM capacitive element with a large capacitance can be manufactured with a high yield.

摘要翻译： 在半导体衬底上提供较低的互连。 MIM电容元件设置在第一层间绝缘膜上，其中下互连被埋入，并且包括下电极，上电极和夹在其间的电介质膜。 在MIM电容元件被埋置的第二层间绝缘膜上设置上互连。 触点电连接下电极和上互连。 下电极主要由Al形成，使得它们的电阻低于阻挡金属，并且应力值也较低。 因此，可以扩大用于电连接触点的下电极的面积，同时抑制它们对电荷累积的影响和下电极与绝缘膜之间的紧密接触。 此外，由于电阻降低，所以能够提高下部电极的厚度。 因此，可以以高产率制造具有大电容的MIM电容元件。

公开(公告)号：US20110254130A1

公开(公告)日：2011-10-20

申请号：US13173709

申请日：2011-06-30

申请人： Masayuki FURUMIYA ,  Kuniko KIKUTA ,  Ryota YAMAMOTO ,  Makoto NAKAYAMA

发明人： Masayuki FURUMIYA ,  Kuniko KIKUTA ,  Ryota YAMAMOTO ,  Makoto NAKAYAMA

IPC分类号： H01L29/92

CPC分类号： H01L23/5223 ,  H01L27/0805 ,  H01L28/87 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

摘要翻译： 半导体器件具有形成在半导体器件上的半导体衬底，多层布线结构以及在多层布线结构中建立的金属 - 绝缘体 - 金属（MIM）电容器布置。 MIM电容器装置包括以规则的间隔彼此平行地排列的第一，第二，第三，第四，第五和第六电极结构。 第一，第二，第五和第六电极结构彼此电连接以限定第一电容器，并且第三和第四电极结构彼此电连接以限定第二电容器。

公开(公告)号：US20090242267A1

公开(公告)日：2009-10-01

申请号：US12412425

申请日：2009-03-27

申请人： Makoto NAKAYAMA ,  Shinichi HAMAGUCHI ,  Yutaka SEKIUCHI

发明人： Makoto NAKAYAMA ,  Shinichi HAMAGUCHI ,  Yutaka SEKIUCHI

IPC分类号： H05K5/00

CPC分类号： H05K5/0073

摘要： A box for accommodating an electric connection box is provided. The box includes a lower cover which comprises a plurality of walls for surrounding a space to accommodate the electric connection box toward a predetermined insertion direction, and an upper cover. The plurality of walls includes: a first wall which extends along the insertion direction; second and third walls which extend from the first wall in a direction intersecting the insertion direction and faces each other; a fourth wall which extends from the first, second and third walls at a deep side of the insertion direction so as to support the electric connection box; and a fifth wall which extends from the second and third walls along the insertion direction, and is substantially parallel to the first wall so as to press-sandwich the electric connection box by the first and fifth walls.

摘要翻译： 提供一种用于容纳电连接盒的盒子。 该盒包括一个下盖，该下盖包括多个壁，用于围绕一个空间以便朝着预定的插入方向容纳电连接盒，以及一个上盖。 多个壁包括：沿插入方向延伸的第一壁; 第二和第三壁，其在与插入方向相交的方向上从第一壁延伸并彼此面对; 第四壁，其从所述第一，第二和第三壁在所述插入方向的深侧延伸，以支撑所述电连接盒; 以及第五壁，其从第二和第三壁沿着插入方向延伸，并且基本上平行于第一壁，以便通过第一壁和第五壁将电连接盒夹紧。

公开(公告)号：US20090194324A1

公开(公告)日：2009-08-06

申请号：US12362047

申请日：2009-01-29

申请人： Makoto NAKAYAMA ,  Shinichi Hamaguchi

发明人： Makoto NAKAYAMA ,  Shinichi Hamaguchi

IPC分类号： H05K5/00

CPC分类号： H02G3/081

摘要： An electric distribution box includes a resin exterior cover which houses an interior component and has an opening for resin-molding the exterior cover on a bottom wall of the exterior cover, and a resin cap which is fit into the opening to close the opening. A flange formed on an outer periphery of the resin cap is kept in intimate contact with the bottom wall of the exterior cover. A molding hole for forming a locking piece by resin molding is provided on the flange. The locking piece locks the resin cap to the opening of the exterior cover. A swell is formed at an entire peripheral edge of the molding hole of the resin cap. An outer face of the interior component is kept in intimate contact with the swell so that the molding hole of the resin cap is closed by the outer face of the interior component and the flange is kept in intimate contact with the bottom wall of the exterior cover.

摘要翻译： 配电箱包括：树脂外盖，其容纳内部部件，并且具有用于在外盖的底壁上树脂成型外盖的开口;以及树脂盖，该树脂盖配合到开口中以封闭开口。 形成在树脂盖的外周上的凸缘保持与外盖的底壁紧密接触。 用于通过树脂成型形成锁定件的成型孔设置在凸缘上。 锁定件将树脂盖锁定到外盖的开口。 在树脂盖的成形孔的整个周缘形成有隆起。 内部部件的外表面与膨胀保持紧密接触，使得树脂盖的成型孔被内部部件的外表面封闭，凸缘保持与外盖的底壁紧密接触 。