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1.发明授权公开(公告)号：US08587923B2
公开(公告)日：2013-11-19
申请号：US12788340
申请日：2010-05-27
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
CPC分类号： H01G4/30 , H01G4/2325
摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
摘要翻译： 层叠电子部件的制造方法包括以下步骤：制备层压部件主体，所述部件主体包括形成在其中的内部电极，并且每个内部电极部分地暴露在所述部件主体的外表面上，并且形成 外部端子电极，在外部端子电极与内部电极电连接。 形成外部端子电极的步骤包括以下步骤：在内部电极的暴露的表面上形成金属层，在金属层的表面上施加防水剂，以及在组件主体的外表面的一部分上， 定位金属层的端边缘，然后在其上施加斥水剂的金属层上形成导电树脂层。
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2.发明授权Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor 有权具有直接电镀外部端子电极的层压陶瓷电子部件及其制造方法公开(公告)号：US08547683B2
公开(公告)日：2013-10-01
申请号：US12821305
申请日：2010-06-23
申请人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
发明人： Masahito Saruban , Makoto Ogawa , Toshiyuki Iwanaga , Seiichi Matsumoto , Akihiro Motoki , Shunsuke Takeuchi , Seiichi Nishihara , Kenichi Kawasaki
CPC分类号： H01G4/2325 , H01G4/30 , H01L41/083 , H01L41/293
摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。
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公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
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公开(公告)号：US08724291B2
公开(公告)日：2014-05-13
申请号：US13365280
申请日：2012-02-03
IPC分类号： H01G4/00
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
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公开(公告)号：US08484815B2
公开(公告)日：2013-07-16
申请号：US13295151
申请日：2011-11-14
IPC分类号： H01G7/00
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 μm on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.
摘要翻译： 一种层叠电子部件的制造方法，其包括具有层叠功能层的电子部件主体，配置在所述电子部件主体内部的一部分的内部导体，其一部分露出在所述电子部件主体的外表面的露出部，以及 设置在电子部件主体的外表面上以连接到内部导体并覆盖内部导体的暴露部分的外部端子电极包括以下步骤：形成具有金属颗粒的平均粒径的基板镀膜 通过直接电镀在电子部件主体的外表面上至少约1.0μm，以便在电子部件主体上形成外部端子电极时覆盖内部导体的露出部分。
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公开(公告)号：US08130485B2
公开(公告)日：2012-03-06
申请号：US12356561
申请日：2009-01-21
申请人： Makoto Ogawa , Akihiro Motoki , Ichiro Nakamura , Norihiro Yoshikawa , Toshiyuki Iwanaga , Kenichi Kawasaki , Shunsuke Takeuchi
发明人： Makoto Ogawa , Akihiro Motoki , Ichiro Nakamura , Norihiro Yoshikawa , Toshiyuki Iwanaga , Kenichi Kawasaki , Shunsuke Takeuchi
CPC分类号： H01G4/2325 , C25D5/50 , C25D7/00 , C25D15/00 , H01G4/30
摘要： When external electrodes of a multilayer ceramic capacitor are formed by performing direct plating on surfaces at which internal electrodes are exposed without forming paste electrode layers, bonding forces of plating layers are relatively weak, and in addition, when glass particles are included in the plating layers, blisters are often generated. To overcome these problems, a multilayer ceramic capacitor is formed by performing electrolytic plating using a plating bath including glass particles, electrolytic plating layers including glass particles dispersed therein are formed as the external electrodes.
摘要翻译： 当多层陶瓷电容器的外部电极通过在内部电极暴露的表面上进行直接电镀形成而不形成糊状电极层而形成时，镀层的结合力相对较弱，此外，当镀层中包含玻璃粒子时 通常会产生水疱。 为了克服这些问题，通过使用包括玻璃颗粒的电镀液进行电解电镀形成多层陶瓷电容器，形成包括分散在其中的玻璃粒子的电解电镀层作为外部电极。
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公开(公告)号：US08139342B2
公开(公告)日：2012-03-20
申请号：US12466393
申请日：2009-05-15
IPC分类号： H01G4/228
CPC分类号： H01G4/008 , H01G4/005 , H01G4/2325 , Y10T29/417 , Y10T29/43 , Y10T29/435
摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
摘要翻译： 层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径 限定衬底镀膜至少约1.0μm。 外部端子电极包括设置在基板镀膜上的至少一层上镀层。 限定衬底镀膜的金属颗粒是Cu颗粒。
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公开(公告)号：US08228663B2
公开(公告)日：2012-07-24
申请号：US12616844
申请日：2009-11-12
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译： 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。
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9.发明授权公开(公告)号：US08077445B2
公开(公告)日：2011-12-13
申请号：US12405370
申请日：2009-03-17
申请人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
发明人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , B32B18/00 , C04B2237/346 , C04B2237/66 , C04B2237/68 , C04B2237/704 , H01C1/142 , H01C7/008 , H01G4/232 , Y10T428/265 , Y10T428/31678
摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
摘要翻译： 一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层， 其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。
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公开(公告)号：US08125763B2
公开(公告)日：2012-02-28
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译： 多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触 并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。 包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。 铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。
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