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    Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity
    1.
    发明授权
    Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity 失效
    具有低热膨胀系数和高导热性的环氧树脂成型组合物

    公开(公告)号：US4358552A

    公开(公告)日：1982-11-09

    申请号：US185765

    申请日：1981-09-10

    申请人： Makoto Shinohara ,  James J. Miyashiro

    发明人： Makoto Shinohara ,  James J. Miyashiro

    IPC分类号： C08K3/34 ,  H01B3/40 ,  H01L23/29 ,  C08L63/00

    CPC分类号： H01L23/295 ,  C08K3/34 ,  H01B3/40 ,  H01L2924/0002 ,  Y10T428/31511

    摘要： An improved epoxy molding composition for encapsulating microelectronic devices wherein the molding composition, after conversion to a thermoset condition, i.e., infusible state, by the application of heat and pressure, displays a low coefficient of thermal expansion and a high thermal conductivity. The dual properties of low coefficient of thermal expansion and high thermal conductivity are imparted to the molding composition by the incorporation therein of a specific anisotropic, polycrystalline, sintered ceramic product which is relatively non-abrasive and free of ionic contaminants and which has cordierite as its primary phase, consisting essentially on an analytical oxide basis of 11.5 to 16.5% RO, 33 to 41% Al.sub.2 O.sub.3 and 46.6 to 53% SiO.sub.2.

    摘要翻译： 用于封装微电子器件的改进的环氧模塑组合物，其中模塑组合物在转化为热固性状态即不可熔状态之后，通过施加热和压力显示出低热膨胀系数和高导热性。 通过在其中加入特定的各向异性多晶的烧结陶瓷产品，其具有低的热膨胀系数和高热导率的双重特性，该特定的各向异性多晶的烧结陶瓷产品相对不磨蚀并且不含离子污染物，并且其具有堇青石 初级相，主要基于11.5至16.5％RO，33至41％Al 2 O 3和46.6至53％SiO 2的分析氧化物基础。