Measurement of the dynamic characteristics of interferometric modulators
    1.
    发明授权
    Measurement of the dynamic characteristics of interferometric modulators 失效
    干涉式调制器的动态特性测量

    公开(公告)号:US07453579B2

    公开(公告)日:2008-11-18

    申请号:US11223824

    申请日:2005-09-09

    IPC分类号: G01B9/02

    摘要: Various systems and methods of lighting a display are disclosed. In one embodiment, for example, a method includes applying a voltage waveform to the interferometric modulators, applying a voltage pulse to the interferometric modulators, detecting reflectivity of light from the interferometric modulators, and determining one or more quality parameters of the interferometric modulators based on the detecting reflectivity of light, where the applied voltage pulse causes the interferometric modulators to vary between an actuated and a non-actuated state, or an non-actuated state and an actuated state.

    摘要翻译: 公开了照明显示器的各种系统和方法。 在一个实施例中,例如,一种方法包括将电压波形施加到干涉式调制器,向干涉式调制器施加电压脉冲,检测来自干涉式调制器的光的反射率,以及基于以下步骤确定干涉式调制器的一个或多个质量参数: 光的检测反射率,其中所施加的电压脉冲导致干涉式调制器在致动和非致动状态之间变化,或者非致动状态和致动状态。

    METHOD OF MAKING AN ELECTRONIC DEVICE WITH A CURVED BACKPLATE
    2.
    发明申请
    METHOD OF MAKING AN ELECTRONIC DEVICE WITH A CURVED BACKPLATE 有权
    制造具有弯曲背板的电子设备的方法

    公开(公告)号:US20110053304A1

    公开(公告)日:2011-03-03

    申请号:US12904825

    申请日:2010-10-14

    IPC分类号: H01L21/00

    CPC分类号: G02B26/001

    摘要: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    摘要翻译: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装,并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面,由此形成封装。

    System and method of testing humidity in a sealed MEMS device
    3.
    发明授权
    System and method of testing humidity in a sealed MEMS device 失效
    在密封的MEMS器件中测试湿度的系统和方法

    公开(公告)号:US07623752B2

    公开(公告)日:2009-11-24

    申请号:US12021196

    申请日:2008-01-28

    IPC分类号: G02B6/00

    摘要: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.

    摘要翻译: 一个实施例提供了一种测试湿度的方法,包括:i)确定包围多个干涉式调制器的设备的属性,以及ii)至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度 所确定的性质,其中所确定的性质包括i)所述装置的密封件的厚度和宽度以及ii)所述装置的部件的粘合剂渗透性中的至少一种。 在一个实施例中,确定的属性还包括以下至少一个:i)设备内部的温度 - 湿度组合,ii)设备内部的干燥剂容量,以及iii)设备尺寸。

    Method of making an electronic device with a curved backplate
    4.
    发明授权
    Method of making an electronic device with a curved backplate 有权
    制造具有弯曲背板的电子设备的方法

    公开(公告)号:US08853747B2

    公开(公告)日:2014-10-07

    申请号:US12904825

    申请日:2010-10-14

    IPC分类号: H01L29/80 G02B26/00

    CPC分类号: G02B26/001

    摘要: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    摘要翻译: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装,并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面,由此形成封装。

    System and method of testing humidity in a sealed MEMS device
    5.
    发明授权
    System and method of testing humidity in a sealed MEMS device 失效
    在密封的MEMS器件中测试湿度的系统和方法

    公开(公告)号:US08244092B2

    公开(公告)日:2012-08-14

    申请号:US12577016

    申请日:2009-10-09

    IPC分类号: G02B6/00

    摘要: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.

    摘要翻译: 一个实施例提供了一种测试湿度的方法,包括:i)确定包围多个干涉式调制器的设备的属性,以及ii)至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度 所确定的性质,其中所确定的性质包括i)所述装置的密封件的厚度和宽度以及ii)所述装置的部件的粘合剂渗透性中的至少一种。 在一个实施例中,确定的属性还包括以下至少一个:i)设备内部的温度 - 湿度组合,ii)设备内部的干燥剂容量,以及iii)设备尺寸。

    PACKAGING FOR AN INTERFEROMETRIC MODULATOR WITH A CURVED BACK PLATE
    6.
    发明申请
    PACKAGING FOR AN INTERFEROMETRIC MODULATOR WITH A CURVED BACK PLATE 有权
    具有弯曲背板的干涉式调制器的包装

    公开(公告)号:US20080164544A1

    公开(公告)日:2008-07-10

    申请号:US12019590

    申请日:2008-01-24

    IPC分类号: H01L29/84 H01L21/50

    CPC分类号: G02B26/001

    摘要: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    摘要翻译: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装,并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面,由此形成封装。

    Electrical characterization of interferometric modulators
    7.
    发明授权
    Electrical characterization of interferometric modulators 有权
    干涉式调制器的电气特性

    公开(公告)号:US07804636B2

    公开(公告)日:2010-09-28

    申请号:US11743594

    申请日:2007-05-02

    IPC分类号: G02B26/00 G02B26/08 G02F1/29

    摘要: Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is applied to conductive leads in the display and the resulting current is measured. The voltage may be controlled so as to ensure that interferometric modulators do not actuate during the resistance measurements. Also disclosed are methods for conditioning interferometric modulator display by applying a voltage waveform that causes actuation of interferometric modulators in the display.

    摘要翻译: 本文公开了用于测试反射显示器的电气特性的方法和系统,包括干涉式调制器显示器。 在一个实施例中,将受控电压施加到显示器中的导电引线,并且测量所得到的电流。 可以控制电压以确保在电阻测量期间干涉式调制器不起动。 还公开了通过施加使显示器中的干涉式调制器致动的电压波形来调节干涉式调制器显示的方法。

    SYSTEM AND METHOD OF TESTING HUMIDITY IN A SEALED MEMS DEVICE
    8.
    发明申请
    SYSTEM AND METHOD OF TESTING HUMIDITY IN A SEALED MEMS DEVICE 失效
    密封MEMS器件测试湿度的系统和方法

    公开(公告)号:US20100024523A1

    公开(公告)日:2010-02-04

    申请号:US12577016

    申请日:2009-10-09

    IPC分类号: G01B9/02 G01N5/02

    摘要: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.

    摘要翻译: 一个实施例提供了一种测试湿度的方法,包括:i)确定包围多个干涉式调制器的设备的属性,以及ii)至少部分地基于以下方式确定设备内的相对湿度值或相对湿度的程度 所确定的性质,其中所确定的性质包括i)所述装置的密封件的厚度和宽度以及ii)所述装置的部件的粘合剂渗透性中的至少一种。 在一个实施例中,确定的属性还包括以下至少一个:i)设备内部的温度 - 湿度组合,ii)设备内部的干燥剂容量,以及iii)设备尺寸。

    System and method of testing humidity in a sealed MEMS device
    9.
    发明授权
    System and method of testing humidity in a sealed MEMS device 失效
    在密封的MEMS器件中测试湿度的系统和方法

    公开(公告)号:US07570865B2

    公开(公告)日:2009-08-04

    申请号:US12021218

    申请日:2008-01-28

    IPC分类号: G02B6/00

    摘要: One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.

    摘要翻译: 一个实施例提供了测试湿度的方法。 该方法包括测量i)包围多个干涉式调制器的第一装置的第一权重和ii)封闭多个干涉式调制器的第二装置的第二权重,其中第一和第二装置含有不同量的水 汽。 该方法还包括比较第一和第二装置的重量,并且至少部分地基于重量比较来确定两个装置之一内的相对湿度值或相对湿度的程度。 在一个实施例中,考虑以下参数中的至少一个来确定相对湿度值或度数:i)至少一个装置内的温度 - 湿度组合,ii)至少一个装置的密封件的厚度和宽度 ,iii)所述至少一个装置的部件的粘合剂渗透性,iv)所述至少一个装置内的干燥剂容量,以及v)装置尺寸。

    System and method of testing humidity in a sealed MEMS device
    10.
    发明授权
    System and method of testing humidity in a sealed MEMS device 失效
    在密封的MEMS器件中测试湿度的系统和方法

    公开(公告)号:US07343080B2

    公开(公告)日:2008-03-11

    申请号:US11173822

    申请日:2005-07-01

    IPC分类号: G02B6/00

    摘要: One embodiment provides a method of testing humidity, comprising: determining a property of a device which encloses a plurality of interferometric modulators; and determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property. In one embodiment, the property of the device includes one of the following: i) a weight of the device, ii) a color change of a desiccant enclosed in the device, iii) a resistance inside the device, iv) whether frost formed in an inside area of the device which is contacted by a cold finger device, v) whether a desiccant enclosed in the device, when water vapor is provided into the device, is working properly, and vi) combination of at lest two of i)-v).

    摘要翻译: 一个实施例提供一种测试湿度的方法,包括:确定包围多个干涉式调制器的装置的属性; 以及至少部分地基于所确定的属性来确定所述装置内的相对湿度值或相对湿度的程度。 在一个实施例中,设备的特性包括以下之一:i)设备的重量,ii)封装在设备中的干燥剂的颜色变化,iii)设备内部的电阻,iv)是否形成 设备的内部区域,其由冷指装置接触,v)当在设备中提供水蒸气时,包封在设备中的干燥剂是否正常工作,以及vi)至少两个组合,i) - v)。