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公开(公告)号：US07781311B2
公开(公告)日：2010-08-24
申请号：US11642904
申请日：2006-12-20
IPC分类号： H01L21/44
CPC分类号： B81C1/00611 , B81B2203/0353 , B81B2207/07 , B81C2201/0123 , H01L23/5226 , H01L2924/0002 , Y10S438/947 , H01L2924/00
摘要： System and method for filling vias in integrated circuits A preferred embodiment comprises forming a spacer layer on a substrate, forming a via with walls and a bottom in the spacer layer, depositing a conformal conductive layer on the spacer layer and on the walls and bottom of the via, spinning-on a photo-definable material on the conductive layer, forming a fill layer on the conductive layer and filling the via, exposing portions of the fill layer to an exposing light using a photomask, developing the fill layer to remove select portions of the fill layer and leave a portion of the fill layer filling the via, and removing the spacer layer. The use of a spin-on photo-definable material increases the material's filling and planarizing capabilities, while enabling a reduction in the number of process steps, which may reduce the likelihood of manufacturing defects, thereby increasing manufacturing yield.
摘要翻译： 用于在集成电路中填充过孔的系统和方法优选实施例包括在衬底上形成间隔层，在间隔层中形成具有壁和底部的通孔，在间隔层上以及在隔离层的壁和底部上沉积共形导电层 所述通孔在所述导电层上旋转可光学定义的材料，在所述导电层上形成填充层并填充所述通孔，使用光掩模将所述填充层的部分暴露于曝光光，显影所述填充层以除去选择 填充层的部分并留下填充层的填充层的一部分，并且去除间隔层。 使用旋涂光可定义材料增加了材料的填充和平面化能力，同时能够减少工艺步骤的数量，这可能降低制造缺陷的可能性，从而提高制造产量。
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公开(公告)号：US20080150150A1
公开(公告)日：2008-06-26
申请号：US11642904
申请日：2006-12-20
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： B81C1/00611 , B81B2203/0353 , B81B2207/07 , B81C2201/0123 , H01L23/5226 , H01L2924/0002 , Y10S438/947 , H01L2924/00
摘要： System and method for filling vias in integrated circuits A preferred embodiment comprises forming a spacer layer on a substrate, forming a via with walls and a bottom in the spacer layer, depositing a conformal conductive layer on the spacer layer and on the walls and bottom of the via, spinning-on a photo-definable material on the conductive layer, forming a fill layer on the conductive layer and filling the via, exposing portions of the fill layer to an exposing light using a photomask, developing the fill layer to remove select portions of the fill layer and leave a portion of the fill layer filling the via, and removing the spacer layer. The use of a spin-on photo-definable material increases the material's filling and planarizing capabilities, while enabling a reduction in the number of process steps, which may reduce the likelihood of manufacturing defects, thereby increasing manufacturing yield.
摘要翻译： 用于在集成电路中填充过孔的系统和方法优选实施例包括在衬底上形成间隔层，在间隔层中形成具有壁和底部的通孔，在间隔层上以及在隔离层的壁和底部上沉积共形导电层 所述通孔在所述导电层上旋转可光学定义的材料，在所述导电层上形成填充层并填充所述通孔，使用光掩模将所述填充层的部分暴露于曝光光，显影所述填充层以除去选择 填充层的部分并留下填充层的填充层的一部分，并且去除间隔层。 使用旋涂光可定义材料增加了材料的填充和平面化能力，同时能够减少工艺步骤的数量，这可能降低制造缺陷的可能性，从而提高制造产量。
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公开(公告)号：US20090067025A1
公开(公告)日：2009-03-12
申请号：US11852629
申请日：2007-09-10
CPC分类号： G02B26/0841
摘要： In accordance with one embodiment of the present disclosure, a method for filling a void of an electromechanical system includes forming a void within a support layer. A conductive layer is formed outwardly from the support layer such that a portion of the conductive layer partially fills the void. A remainder of the void is filled with an inorganic material. A mirror is formed outwardly from the inorganic material and the conductive layer.
摘要翻译： 根据本公开的一个实施例，用于填充机电系统的空隙的方法包括在支撑层内形成空隙。 导电层从支撑层向外形成，使得导电层的一部分部分填充空隙。 空隙的剩余部分填充有无机材料。 从无机材料和导电层向外形成反射镜。
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