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    Modular capillary pumped loop cooling system
    3.
    发明授权
    Modular capillary pumped loop cooling system 有权
    模块化毛细管泵回路冷却系统

    公开(公告)号：US07770630B2

    公开(公告)日：2010-08-10

    申请号：US10648170

    申请日：2003-08-26

    申请人： Jason B. Chesser ,  Barrett M. Faneuf ,  Stephen W. Montgomery

    发明人： Jason B. Chesser ,  Barrett M. Faneuf ,  Stephen W. Montgomery

    IPC分类号： F25B29/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/043 ,  F28D15/046 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20009 ,  H05K7/20809 ,  H01L2924/00

    摘要： A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

    摘要翻译： 模块化毛细管泵回路（CPL）冷却系统及相关部件。 模块化CPL冷却系统将热量从诸如设置在计算机机架内的微处理器的大功率电路组件传送到机箱内部或外部的其他位置，其中可以更容易地去除热量。 在各种实施例中，CPL冷却系统包括通过柔性液体输送和蒸汽输送管线连接到一个或多个冷凝器的一个或多个蒸发器。 在每个冷凝器内设置诸如体积的烧结铜的芯吸结构。 芯吸结构基于毛细管机构和芯吸结构的上表面上的弯液面/蒸气界面之间的压力差将液态的工作流体（例如水）吸入蒸发器。 当液体弯液面蒸发时，另外的流体被吸入蒸发器。 然后将工作流体冷凝回冷凝器中的液体。

    Rack-mounted server and associated methods
    5.
    发明授权
    Rack-mounted server and associated methods 有权
    机架式服务器及相关方法

    公开(公告)号：US06560114B2

    公开(公告)日：2003-05-06

    申请号：US09896857

    申请日：2001-06-29

    申请人： William E. Berry ,  Robert J. Fite ,  Tomm V. Aldridge ,  Barrett M. Faneuf

    发明人： William E. Berry ,  Robert J. Fite ,  Tomm V. Aldridge ,  Barrett M. Faneuf

    IPC分类号： G06F116

    CPC分类号： H05K7/1489

    摘要： An improved rack-mounted server comprises, in one embodiment, a slidable electronics tray having a top cover secured to the rack, to facilitate access to the tray when it is withdrawn from the rack. The tray also includes a camming mechanism to facilitate insertion of the tray into and its extraction from cable connectors or plugs affixed to the rack. The tray includes, in one embodiment, a movement detection mechanism to power it up or down when tray insertion or removal, respectively, is initiated. In addition, the rack includes an improved cable management system that can accommodate different cables and cable plugs. As a tray is inserted into or removed from the rack, corresponding connectors on the tray are electrically coupled to or uncoupled from cable plugs affixed to the rack, eliminating any need to remove cables from the tray or reinstall them.

    摘要翻译： 在一个实施例中，改进的机架式服务器包括具有固定到机架的顶盖的滑动式电子托盘，以便当托架从机架中取出时便于进入托盘。 托盘还包括凸轮机构，以便于将托盘插入其中并将其从固定到机架上的电缆连接器或插头拔出。 在一个实施例中，托盘包括移动检测机构，以分别在启动托盘插入或移除时向上或向下供电。 此外，机架还包括一个改进的电缆管理系统，可以适应不同的电缆和电缆插头。 当托盘被插入或从机架移除时，托盘上的相应连接器电耦合到固定到机架上的电缆插头或从电缆插头脱开，从而不需要从托盘中移除电缆或重新安装它们。

    Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
    6.
    发明授权
    Frame-level thermal interface component for transfer of heat from an electronic component of a computer system 有权
    用于从计算机系统的电子部件传送热量的帧级热接口部件

    公开(公告)号：US07233491B2

    公开(公告)日：2007-06-19

    申请号：US11415559

    申请日：2006-05-01

    申请人： Barrett M. Faneuf ,  David S. De Lorenzo

    发明人： Barrett M. Faneuf ,  David S. De Lorenzo

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809

    摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

    摘要翻译： 描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。 每个服务器单元子组件具有与框架上的框架部件接合的底座部件。 热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。 在一个实施例中，空气管道位于多个框架部件上。 热量从框架部件转移到流过管道的空气中。 改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

    Baffles for high capacity air-cooling systems for electronics apparatus
    7.
    发明授权
    Baffles for high capacity air-cooling systems for electronics apparatus 失效
    用于电子设备的大容量空气冷却系统的挡板

    公开(公告)号：US07079388B2

    公开(公告)日：2006-07-18

    申请号：US10931634

    申请日：2004-09-01

    申请人： Barrett M. Faneuf ,  William E. Berry ,  Ven R. Holalkere

    发明人： Barrett M. Faneuf ,  William E. Berry ,  Ven R. Holalkere

    IPC分类号： G06F1/16

    CPC分类号： H05K7/20727

    摘要： An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

    摘要翻译： 用于高性能，高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇，具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室 以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。 空气冷却系统设计用于为诸如服务器的低高度，高发热电子模块提供最大的冷却。 通过仅使用与挡板的低阻气流特性匹配的单个风扇，空气冷却系统比多风扇系统具有显着的优点。 还描述了一种计算机服务器和制造散热设备的方法。

    Cooling method and apparatus for handheld devices
    9.
    发明授权
    Cooling method and apparatus for handheld devices 有权
    手持设备的冷却方法和装置

    公开(公告)号：US06741465B2

    公开(公告)日：2004-05-25

    申请号：US10112633

    申请日：2002-03-29

    申请人： Ven R. Holalkere ,  Barrett M. Faneuf

    发明人： Ven R. Holalkere ,  Barrett M. Faneuf

    IPC分类号： G06F120

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A method and apparatus for cooling an electronic component within a handheld device comprised of an extension to the casing of the handheld device and at least one portion of a cooling apparatus within the extension.

    摘要翻译： 一种用于冷却手持装置内的电子部件的方法和装置，包括对手持装置的壳体的延伸部以及延伸部内的冷却装置的至少一部分。

    Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
    10.
    发明授权
    Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system 失效
    机箱级热接口组件，用于从计算机系统的电子部件传输热量

    公开(公告)号：US06643132B2

    公开(公告)日：2003-11-04

    申请号：US10039003

    申请日：2002-01-04

    申请人： Barrett M. Faneuf ,  David S. De Lorenzo

    发明人： Barrett M. Faneuf ,  David S. De Lorenzo

    IPC分类号： H05K720

    CPC分类号： H05K7/20809 ,  G06F1/20

    摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

    摘要翻译： 描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。 每个服务器单元子组件具有与框架上的框架部件接合的底座部件。 热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。 在一个实施例中，空气管道位于多个框架部件上。 热量从框架部件转移到流过管道的空气中。 改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。