Dough rolling apparatus and method
    1.
    发明申请
    Dough rolling apparatus and method 有权
    面团轧制装置及方法

    公开(公告)号:US20060062879A1

    公开(公告)日:2006-03-23

    申请号:US10946831

    申请日:2004-09-22

    IPC分类号: A21D6/00

    CPC分类号: A21C3/06 A21C11/10

    摘要: An improved dough-rolling apparatus and method for rolling sheeted dough. The proposed invention comprises a dough-rolling apparatus having a dough sheeter, a sheeting conveyor having a ramped section, a roll-initiating curtain positioned above the ramped section, and a roll-completing curtain positioned above the conveyor and downstream from the roll-initiating conveyor. Sheeted and cut dough pieces are deposited onto a steel mesh, partially-ramped sheeter belt, where two wire-mesh rolling curtains are draped onto the sheeter belt to induce rolling of the dough pieces.

    摘要翻译: 一种改进的面团轧制设备和用于轧制生面团的方法。 所提出的发明包括具有面团片材的面团轧制设备,具有倾斜部分的片材输送机,位于倾斜部分上方的卷起始帘幕,以及位于输送机上方并且在卷起始位置的下游的卷帘幕 输送带。 将成片和切割的面团片沉积到钢网,部分斜坡的折页机上,其中两个丝网卷帘被覆在片材带上以引起面片的滚动。

    Method for adhering large seasoning bits to a food substrate
    2.
    发明申请
    Method for adhering large seasoning bits to a food substrate 失效
    将大型调味料料粘附到食品基材上的方法

    公开(公告)号:US20050095328A1

    公开(公告)日:2005-05-05

    申请号:US10696970

    申请日:2003-10-30

    CPC分类号: A23L7/13 A23L7/122 A23P20/12

    摘要: A method for adhering large three-dimensional seasoning bits to a snack food base whereby the bits are substantially adhered to the food substrate, or chip. A topping comprising large seasoning bits and a dry adhesive is applied to a cooked chip. The topped, cooked chip is then heated to a temperature such that the dry adhesive undergoes a glass transition and flows down around the bit to the bit and food substrate contact point. The topped, cooked chip is then subjected to changed process conditions, such as cooling, the adhesive hardens, and a bond is formed between the chip and the seasoning bits.

    摘要翻译: 一种用于将大型三维调味料料浆料粘贴到小吃食品基料上的方法,由此使得这些料料基本上粘附到食品基材或芯片上。 将包括大调味料和干燥粘合剂的顶部施加到煮熟的芯片上。 然后将顶部煮熟的芯片加热到一定温度,使得干燥的粘合剂经历玻璃化转变并沿着钻头向下流动到钻头和食品基底接触点。 然后将顶部熟的芯片进行改变的工艺条件,例如冷却,粘合剂硬化,并且在芯片和调味料之间形成粘合。