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11 条记录 (耗时 0.013 秒)

    Self-securing heat sink
    1.
    发明授权
    Self-securing heat sink 失效
    自固定散热片

    公开(公告)号：US4609040A

    公开(公告)日：1986-09-02

    申请号：US718556

    申请日：1985-04-01

    申请人： Marvin F. Moore

    发明人： Marvin F. Moore

    IPC分类号： H01L23/40

    CPC分类号： H01L23/4093 ,  H01L2924/0002

    摘要： A self-securing heat sink for transistors and the like comprises a unitary member that is constructed from a malleable material having a high heat transfer coefficient. The unitary member includes a base portion, at least one heat radiating fin portion, and a clip portion that is capable of engaging a transistor to retain the heat sink securely on the transistor without necessitating the use of threaded fasteners, rivets, or the like.

    摘要翻译： 用于晶体管等的自固定散热器包括由具有高传热系数的可延展材料构成的整体构件。 整体构件包括基部，至少一个散热翅片部分和夹持部分，其能够接合晶体管以将散热器牢固地保持在晶体管上，而不需要使用螺纹紧固件，铆钉等。

    Spring clip fastener for mounting of printed circuit board components
    2.
    发明授权
    Spring clip fastener for mounting of printed circuit board components 失效
    用于安装印刷电路板部件的弹簧夹紧件

    公开(公告)号：US4575038A

    公开(公告)日：1986-03-11

    申请号：US626662

    申请日：1984-07-02

    申请人： Marvin F. Moore

    发明人： Marvin F. Moore

    IPC分类号： H05K3/30 ,  H05K7/12 ,  A47B97/00

    CPC分类号： H05K3/301 ,  H05K7/12

    摘要： A spring clip fastener (10) is provided for mounting a heat sink (40) and a semiconductor device package (42) to a circuit board (44). Spring clip fastener (10) includes a spring portion (12). Support members (14, 16) extend from the spring portion (12) for supporting the spring portion (12) above the surface of the circuit board (44). A shoulder (18, 20) is contained within the support members (14, 16), such that the spring portion (12) urges the semiconductor device package (42) against the heat sink (40). Feet (30, 32) extend from support members (22, 24) for engaging holes (46, 52) of the circuit board (44). Feet (30, 32) are coated with a solder-promoting material.

    摘要翻译： 提供了一种用于将散热器（40）和半导体器件封装（42）安装到电路板（44）的弹簧夹紧件（10）。 弹簧夹紧件（10）包括弹簧部分（12）。 支撑构件（14,16）从用于将弹簧部分（12）支撑在电路板（44）的表面上方的弹簧部分（12）延伸。 肩部（18,20）被容纳在支撑构件（14,16）内，使得弹簧部分（12）将半导体器件封装（42）推向散热器（40）。 脚（30,32）从用于接合电路板（44）的孔（46,52）的支撑构件（22,24）延伸。 脚（30,32）涂有助焊材料。

    Spring clip fastener for surface mounting of printed circuit board components
    5.
    发明授权
    Spring clip fastener for surface mounting of printed circuit board components 失效
    用于表面安装印刷电路板部件的弹簧夹紧件

    公开(公告)号：US5130888A

    公开(公告)日：1992-07-14

    申请号：US853909

    申请日：1986-04-21

    申请人： Marvin F. Moore

    发明人： Marvin F. Moore

    IPC分类号： H01L23/40

    CPC分类号： H01L23/4093 ,  H01L2924/0002

    摘要： Disclosed is a spring clip fastener for mounting a heat sink and a semiconductor device package to the surface of a circuit board. The fastener includes a spring portion and support members extending from the spring portion for supporting the spring portion above the surface of the circuit board. A shoulder is internally formed in the support members so that the spring portion urges the semiconductor device package against the heat sink. Feet extend from the support members for engaging the surface of the circuit board. The feet are coated with a solder-promoting material.

    摘要翻译： 公开了一种用于将散热器和半导体器件封装安装到电路板表面的弹簧夹紧件。 紧固件包括弹簧部分和从弹簧部分延伸的支撑部件，用于将弹簧部分支撑在电路板的表面之上。 肩部内部形成在支撑构件中，使得弹簧部分将半导体器件封装推向散热器。 脚从用于接合电路板表面的支撑构件延伸。 脚部涂有助焊材料。

    Heat sink and method of manufacture
    6.
    发明授权
    Heat sink and method of manufacture 失效
    散热片和制造方法

    公开(公告)号：US4588028A

    公开(公告)日：1986-05-13

    申请号：US730729

    申请日：1985-05-06

    申请人： Larry D. Marshall ,  Marvin F. Moore

    发明人： Larry D. Marshall ,  Marvin F. Moore

    IPC分类号： H01L23/367 ,  H01L23/40 ,  F28F7/00

    CPC分类号： H01L23/3672 ,  H01L23/4006 ,  H01L2924/0002

    摘要： A heat sink is described that includes a base portion, and having a pair of heat radiating portions attached to the base portion. The heat radiating portions are each of sufficient width so that when bent along a line at roughly their midpoint, the unattached lower edges of such heat radiating portions will be disposed parallel to and in juxtaposition with the free edges of the base portion. Also, the method of manufacturing such heat sink includes, after punching the heat sinks from the sheet of material from which they are constructed, bending the heat radiating portions along the line extending generally through their midpoint and intersecting a corner of the base and then bending each of the heat radiating portions along an edge of the base to a position wherein the heat radiating portions are disposed at approximately 90 degrees to the base portion.

    摘要翻译： 描述了一种散热器，其包括基部，并且具有附接到基部的一对散热部。 散热部分各自具有足够的宽度，使得当沿着大致其中点的线弯曲时，这些散热部分的未连接的下边缘将平行于并且与基部的自由边缘并置设置。 此外，制造这种散热器的方法包括在从构成它们的材料片冲压散热器之后，沿着大体上通过它们的中点延伸的线弯曲散热部分，并与基座的拐角相交，然后弯曲 每个散热部分沿着基座的边缘到散热部分与基部大约成90度的位置。