公开(公告)号：US20080013277A1

公开(公告)日：2008-01-17

申请号：US11576979

申请日：2005-10-13

申请人： Masafumi Ueda ,  Mikio Kondou ,  Yohei Ikawa

发明人： Masafumi Ueda ,  Mikio Kondou ,  Yohei Ikawa

IPC分类号： H05K7/20

CPC分类号： B23K1/0012 ,  B23K2101/14 ,  B23K2101/40 ,  B23K2103/10 ,  F28F3/14 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A method of manufacturing a hollow circuit substrate, of two metal sheets brazed to each other in a laminated state with a bulging hollow circuit for ed between the two metal sheets. Of the upper and lower metal sheets for forming the hollow circuit, a circuit-forming bulging portion is formed in the upper metal sheet. A flux suspension is applied by screen printing to the upper surface of the lower metal sheet so as not to overlap the circuit-forming bulging portion to form flux films. The two metal sheets are stacked on each other so as to close off the opening of the circuit-forming bulging portion and are brazed to each other. This method prevents flux from remaining in a hollow circuit of a manufactured hollow circuit substrate.

摘要翻译： 一种中空电路基板的制造方法，其特征在于，在两层金属板之间以两层金属板相互钎焊的两个金属板和两个金属板之间的凸起中空电路。 在用于形成中空电路的上金属片和下金属片中，在上金属片中形成电路形成凸起部分。 通过丝网印刷将助熔剂悬浮液施加到下金属片的上表面，以便不与电路形成凸起部分重叠以形成焊剂膜。 两个金属片彼此堆叠，以便关闭电路形成凸起部分的开口并彼此钎焊。 该方法可防止在制造的中空电路基板的中空电路中残留磁通。