Silicon layer transfer substrate and method of manufacturing semiconductor substrate
    3.
    发明授权
    Silicon layer transfer substrate and method of manufacturing semiconductor substrate 有权
    硅层转移基板和半导体基板的制造方法

    公开(公告)号:US09018738B2

    公开(公告)日:2015-04-28

    申请号:US13365794

    申请日:2012-02-03

    申请人: Minoru Mitsui

    发明人: Minoru Mitsui

    摘要: A silicon layer transfer substrate includes a silicon substrate of a first substrate, a sacrificial layer, and a transfer silicon layer transferred to a second substrate, wherein the sacrificial layer has a silicon compound layer containing a compound of silicon and at least one element selected from a group consisting of germanium and carbon, and is provided on the silicon substrate of the first substrate, the silicon compound layer having a thickness equal to or smaller than a critical film thickness, the transfer silicon layer transferred to the second substrate is provided on the sacrificial layer, and at least either the silicon substrate or the silicon layer has a groove or a hole connected to the sacrificial layer.

    摘要翻译: 硅层转移衬底包括第一衬底的硅衬底,牺牲层和转移到第二衬底的转移硅层,其中所述牺牲层具有包含硅化合物的硅化合物层和选自以下的至少一种元素: 由锗和碳组成的组,并且设置在第一衬底的硅衬底上,硅化合物层的厚度等于或小于临界膜厚度,转移到第二衬底的转移硅层设置在 牺牲层,并且硅衬底或硅层中的至少一个具有连接到牺牲层的沟槽或孔。

    Field-Effect Transistor and Method of Manufacturing Same
    4.
    发明申请
    Field-Effect Transistor and Method of Manufacturing Same 审中-公开
    场效应晶体管及其制造方法相同

    公开(公告)号:US20080135890A1

    公开(公告)日:2008-06-12

    申请号:US11579944

    申请日:2005-05-31

    IPC分类号: H01L29/94 H01L21/00

    摘要: Disclosed is a manufacturing method for forming a FET on a glass substrate at low temperatures. A polycrystalline silicon layer 2 is formed on a glass substrate 1, germanium layers 11, 12 are formed on the polycrystalline silicon layer in regions that are to become a source and a drain, ions serving as a dopant are implanted into at least the germanium layers, and annealing is subsequently applied to thereby cause the implanted dopant to diffuse into the polycrystalline. silicon layer, form a source region S and a drain region D and crystallize the germanium layers. Alternatively, the dopant is implanted also into the polycrystalline silicon layer at such a dosage that will not cause the polycrystalline silicon layer to become amorphous. Annealing for crystallizing the germanium is subsequently carried out. Annealing may be performed in the neighborhood of 500° C.

    摘要翻译: 公开了一种在低温下在玻璃基板上形成FET的制造方法。 在玻璃基板1上形成多晶硅层2,在要成为源极和漏极的区域中,在多晶硅层上形成锗层11,12,在至少锗层中注入用作掺杂剂的离子 随后施加退火,从而使注入的掺杂剂扩散到多晶中。 硅层,形成源区S和漏区D,并使锗层结晶。 或者,掺杂剂也以不会导致多晶硅层变得无定形的剂量也被注入到多晶硅层中。 随后进行用于结晶锗的退火。 退火可以在500°C附近进行。