公开(公告)号：US20120214317A1

公开(公告)日：2012-08-23

申请号：US13399558

申请日：2012-02-17

申请人： Masaki Murobayashi ,  Takatomo Yamaguchi ,  Kenji Shirako ,  Shuhei Saido ,  Akihiro Sato ,  Yoshinori Imai

发明人： Masaki Murobayashi ,  Takatomo Yamaguchi ,  Kenji Shirako ,  Shuhei Saido ,  Akihiro Sato ,  Yoshinori Imai

IPC分类号： H01L21/31 ,  C23C16/52 ,  C23C16/455

CPC分类号： H01L21/67757 ,  C23C16/325 ,  C23C16/4408 ,  C23C16/45519 ,  C23C16/4584 ,  C23C16/46 ,  C23C16/463 ,  C23C16/54 ,  H01L21/67109

摘要： A substrate processing apparatus includes a processing chamber configured to process a plurality of substrates, a substrate holder accommodated within the processing chamber and configured to hold the substrates in a vertically spaced-apart relationship, a thermal insulation portion configured to support the substrate holder from below within the processing chamber, a heating unit provided to surround a substrate accommodating region within the processing chamber, and a gas supply system configured to supply a specified gas to at least a thermal insulation portion accommodating region within the processing chamber.

摘要翻译： 衬底处理设备包括：处理室，被配置为处理多个衬底;衬底保持器，容纳在处理室内并且被构造成以垂直间隔的关系保持衬底;热绝缘部分，被配置为从下面支撑衬底保持器 在处理室内设置有用于围绕处理室内的基板容纳区域的加热单元，以及构造成将特定气体供给至少处理室内的绝热部分容纳区域的气体供给系统。

公开(公告)号：US06658321B2

公开(公告)日：2003-12-02

申请号：US09956820

申请日：2001-09-21

申请人： Akihiro Osaka ,  Masaki Murobayashi ,  Tatsuhisa Matsunaga ,  Kouichi Noto

发明人： Akihiro Osaka ,  Masaki Murobayashi ,  Tatsuhisa Matsunaga ,  Kouichi Noto

IPC分类号： G06F700

CPC分类号： H01L21/67276 ,  H01L21/68

摘要： Substrate positioning and substrate transporting are processed in parallel, thereby reducing substrate transfer apparatus wait time and improving substrate processing throughput. A substrate transfer apparatus 1 is configured in a single unit, a plural number of wafers W prior to notch alignment is transported at one time from a substrate accommodating container to a substrate alignment apparatus 22, and the plural number of notch aligned wafers is transported from the substrate alignment apparatus 22 to a boat 21. Two stages (upper and lower) of notch alignment units 4 and 5 that configure the substrate alignment apparatus 22 operate independently, and are capable of performing notch alignment, in total, on a number of wafers to be processed that is twice the number of wafers transported at one time by the substrate transfer apparatus 1. While notch alignment is being performed in the one notch alignment unit 4, notch aligned wafers W are transported by the substrate transfer apparatus from the other notch alignment unit 5 to the boat 21, and then wafers prior to notch alignment are transported from the substrate accommodating container to the other notch alignment unit 5.