公开(公告)号：US06906935B2

公开(公告)日：2005-06-14

申请号：US10291637

申请日：2002-11-12

申请人： Masami Nakamura ,  Atsushi Amano ,  Iwao Shimane ,  Yasuyuki Danjou ,  Shigekazu Saito ,  Toshiharu Obu ,  Nobumitsu Tada ,  Hiroki Sekiya

发明人： Masami Nakamura ,  Atsushi Amano ,  Iwao Shimane ,  Yasuyuki Danjou ,  Shigekazu Saito ,  Toshiharu Obu ,  Nobumitsu Tada ,  Hiroki Sekiya

IPC分类号： H01L23/36 ,  H02M7/00 ,  H02M7/48 ,  H02M7/5387 ,  H02M1/00 ,  H05K7/20

CPC分类号： H02M7/003 ,  H01L2224/32225 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00

摘要： In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.

摘要翻译： 在具有多个臂的三相逆变器主电路包括多个用于电力的半导体芯片的逆变器装置中，三相逆变器主电路的一个臂包括IGBT和二极管，半导体芯片的尺寸为10 mm×10 mm以下，半导体芯片并联连接，IGBT和二极管接合到厚度为1.5mm以上且5mm以下的导体，导体通过绝缘体粘合到冷却器 含有陶瓷的树脂片。