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公开(公告)号：US07706919B2
公开(公告)日：2010-04-27
申请号：US10488694
申请日：2002-09-06
CPC分类号： H01L21/67259 , H01L21/681 , H01L21/68707 , Y10T29/41
摘要： An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method.To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.
摘要翻译： 本发明的目的是提供一种用于在不依赖操作者的视线以及用于上述方法的示教夹具的情况下自动而准确地教导半导体晶片的位置的方法。 为此，在本发明中，通过设置在机器人的晶片抓持部5的前端的第一透射型传感器6来检测示教夹具11。 示教夹具11由与半圆形晶片外径相同的大圆盘部分12和与大圆盘部分12同心的小圆盘部分13组成。示教夹具21由第二传动 - 型传感器18设置在晶片抓持部5上。第二传输型传感器18安装在传感器夹具15上，以便从晶片夹持部分5可拆卸。
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公开(公告)号：US20090198377A1
公开(公告)日：2009-08-06
申请号：US11995786
申请日：2006-06-29
申请人： Masaru Adachi , Mitsunori Kawabe
发明人： Masaru Adachi , Mitsunori Kawabe
IPC分类号： H01L21/68
CPC分类号： H01L21/67742 , G05B2219/50125 , H01L21/681
摘要： In the wafer position teaching method for a wafer carrying system, a teaching tool is mounted at a position of the container or the processing equipment where the semiconductor wafer is to be set. The teaching tool is sensed by a sensor provided at a wafer gripping portion of the robot. Prior to sensing the teaching tool by the sensor, external teaching tools mounted on a front external wall of the processing equipment are sensed by the sensor to roughly estimate the position of the teaching tool. Based on the estimated position, the sensor approaches and senses the teaching tool to obtain the position of the semiconductor wafer. Thus, the wafer position can be taught precisely and automatically without causing interference, even when the frontage of processing equipment is narrow.
摘要翻译： 在晶片承载系统的晶片位置示教方法中，将教学工具安装在要设置半导体晶片的容器或处理设备的位置。 该教导工具由设置在机器人的晶片夹持部分处的传感器感测。 在通过传感器感测教导工具之前，安装在处理设备的前外壁上的外部教学工具由传感器感测以粗略地估计教学工具的位置。 基于估计的位置，传感器接近并感测教导工具以获得半导体晶片的位置。 因此，即使当处理设备的正面狭窄时，晶片位置也可以精确而自动地被教导而不引起干扰。
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公开(公告)号：US20060192514A1
公开(公告)日：2006-08-31
申请号：US11403831
申请日：2006-04-14
申请人： Masaru Adachi , Mitsunori Kawabe
发明人： Masaru Adachi , Mitsunori Kawabe
CPC分类号： H01L21/67259 , H01L21/67739 , H01L21/681
摘要： In some preferred embodiments of the present invention, a method of performing calibration of an optical axis of a sensor installed on a hand of an arm of a robot by obtaining misalignment of the optical axis of the sensor relative to the hand or by obtaining misalignment of the hand relative to the arm is provided. A method of performing calibration by detecting a teaching tool 11 disposed at a semiconductor wafer placing position of a storage container or a carrying device by a sensor 6 installed on a hand 5 of a robot 1 to teach the position of the semiconductor wafer to the robot 1 includes a step of placing the teaching tool 11 at specified position with the robot 1, a step of predicting the position of the teaching tool 11 detecting the teaching tool 11 with the sensor 6, and a step of obtaining a difference between the position of the teaching tool 11 and the predicted value.
摘要翻译： 在本发明的一些优选实施例中，一种通过获得传感器的光轴相对于手的偏移或者通过获得未对准的方式来执行安装在机器人手臂的手上的光轴的校准的方法 提供了相对于手臂的手。 通过检测安装在机器人1的手5上的传感器6来设置在存储容器或携带装置的半导体晶片放置位置的教具11来进行校准的方法，以将半导体晶片的位置教导到机器人 图1所示的步骤包括将教具11放置在机器人1的指定位置的步骤，利用传感器6预测教具11检测教具11的位置的步骤， 教学工具11和预测值。
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公开(公告)号：US20050034288A1
公开(公告)日：2005-02-17
申请号：US10488694
申请日：2002-09-06
IPC分类号： B25J9/22 , H01L21/00 , H01L21/68 , H01L21/687 , H01L21/64
CPC分类号： H01L21/67259 , H01L21/681 , H01L21/68707 , Y10T29/41
摘要： An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method. To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.
摘要翻译： 本发明的目的是提供一种用于在不依赖操作者的视线以及用于上述方法的示教夹具的情况下自动而准确地教导半导体晶片的位置的方法。 为此，在本发明中，通过设置在机器人的晶片抓持部5的前端的第一透射型传感器6来检测示教夹具11。 示教夹具11由与半圆形晶片外径相同的大圆盘部分12和与大圆盘部分12同心的小圆盘部分13组成。示教夹具21由第二传动 - 型传感器18设置在晶片抓持部5上。第二传输型传感器18安装在传感器夹具15上，以便从晶片夹持部分5可拆卸。
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公开(公告)号：US08112177B2
公开(公告)日：2012-02-07
申请号：US11995786
申请日：2006-06-29
申请人： Masaru Adachi , Mitsunori Kawabe
发明人： Masaru Adachi , Mitsunori Kawabe
IPC分类号： G05B19/18
CPC分类号： H01L21/67742 , G05B2219/50125 , H01L21/681
摘要： In the wafer position teaching method for a wafer carrying system, a teaching tool is mounted at a position of the container or the processing equipment where the semiconductor wafer is to be set. The teaching tool is sensed by a sensor provided at a wafer gripping portion of the robot. Prior to sensing the teaching tool by the sensor, external teaching tools mounted on a front external wall of the processing equipment are sensed by the sensor to roughly estimate the position of the teaching tool. Based on the estimated position, the sensor approaches and senses the teaching tool to obtain the position of the semiconductor wafer. Thus, the wafer position can be taught precisely and automatically without causing interference, even when the frontage of processing equipment is narrow.
摘要翻译： 在晶片承载系统的晶片位置示教方法中，将教学工具安装在要设置半导体晶片的容器或处理设备的位置。 该教导工具由设置在机器人的晶片夹持部分处的传感器感测。 在通过传感器感测教导工具之前，安装在处理设备的前外壁上的外部教学工具由传感器感测以粗略地估计教学工具的位置。 基于估计的位置，传感器接近并感测教导工具以获得半导体晶片的位置。 因此，即使当处理设备的正面狭窄时，晶片位置也可以精确而自动地被教导而不引起干扰。
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公开(公告)号：US07205742B2
公开(公告)日：2007-04-17
申请号：US11403831
申请日：2006-04-14
申请人： Masaru Adachi , Mitsunori Kawabe
发明人： Masaru Adachi , Mitsunori Kawabe
IPC分类号： G05B19/10
CPC分类号： H01L21/67259 , H01L21/67739 , H01L21/681
摘要： In some preferred embodiments of the present invention, a method of performing calibration of an optical axis of a sensor installed on a hand of an arm of a robot by obtaining misalignment of the optical axis of the sensor relative to the hand or by obtaining misalignment of the hand relative to the arm is provided. A method of performing calibration by detecting a teaching tool 11 disposed at a semiconductor wafer placing position of a storage container or a carrying device by a sensor 6 installed on a hand 5 of a robot 1 to teach the position of the semiconductor wafer to the robot 1 includes a step of placing the teaching tool 11 at specified position with the robot 1, a step of predicting the position of the teaching tool 11 detecting the teaching tool 11 with the sensor 6, and a step of obtaining a difference between the position of the teaching tool 11 and the predicted value.
摘要翻译： 在本发明的一些优选实施例中，一种通过获得传感器的光轴相对于手的偏移或者通过获得未对准的方式来执行安装在机器人手臂的手上的光轴的校准的方法 提供了相对于手臂的手。 通过检测安装在机器人1的手5上的传感器6来设置在存储容器或携带装置的半导体晶片放置位置的教具11来进行校准的方法，以将半导体晶片的位置教导到机器人 图1所示的步骤包括将教具11放置在机器人1的指定位置的步骤，利用传感器6预测教具11检测教具11的位置的步骤， 教学工具11和预测值。
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公开(公告)号：US5341306A
公开(公告)日：1994-08-23
申请号：US923991
申请日：1992-09-16
IPC分类号： B26D5/00 , C03B33/023 , C03B33/037 , G06F17/50 , G06F15/46
CPC分类号： C03B33/023 , C03B33/037 , Y02P40/57
摘要： A blank layout method for planning a product layout having a good yield for plate-glass cutters cutting a plurality of rectangular product plates from a rectangular glass blank is disclosed. When a product plate is laid out on a residual blank space of a glass blank, a plurality of candidate layout plans are prepared, and the same processing is recursively repeated for residual blank spaces in each of the candidate layout plans. The final yields of the candidate layout plans when no more products can be laid out are compared to select a candidate layout plan having the highest yield.
摘要翻译： PCT No.PCT / JP92 / 00118 Sec。 371日期：1992年9月16日 102（e）日期1992年9月16日PCT提交1992年2月5日PCT公布。 公开号WO92 / 13808 日本1982年8月20日。公开了一种用于规划从矩形玻璃坯料切割多个矩形产品板的平板玻璃切割器具有良好产量的产品布局的空白布局方法。 当产品板布置在玻璃坯料的剩余空白空间上时，准备多个候选布局图，并且对每个候选布局图中的残留空白空间递归地重复相同的处理。 比较没有更多产品可以布置的候选人布局图的最终产量，以选择具有最高产量的候选布局图。
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