公开(公告)号：US20120053279A1

公开(公告)日：2012-03-01

申请号：US13191942

申请日：2011-07-27

申请人： Masashi Noda ,  Eiji Matsunaga

发明人： Masashi Noda ,  Eiji Matsunaga

IPC分类号： C08K3/30

CPC分类号： C08K3/36 ,  C08K3/30 ,  C08L57/08

摘要： Provided is a rubber composition, which is excellent in fuel permeation resistance, and is capable of achieving improvements in low-temperature embrittlement property and solvent crack property. The rubber composition includes: a fluororubber having a fluorine concentration content of 70 to 71 wt % as a main component; a crosslink-type agent; and the following components (A) and (B), in which: the total content [(A)+(B)] of the above-mentioned components (A) and (B) falls within the range of 17 to 25 parts by weight with respect to 100 parts by weight of the above-mentioned fluororubber; and a weight ratio (A)/(B) of the content of the above-mentioned component (A) to the content of the above-mentioned component (B) falls within the range of 2.0/1 to 3.0/1: (A) barium sulfate; and (B) a neutral silica.

摘要翻译： 提供一种橡胶组合物，其耐燃性渗透性优异，能够实现低温脆性和溶剂裂纹性的提高。 橡胶组合物包括：氟浓度为70〜71重量％的氟橡胶作为主要成分; 交联型试剂; （A）和（B）的组分（A）和（B）的含量，其中：上述组分（A）和（B）的总含量[（A）+（B） 相对于100重量份上述氟橡胶的重量; 上述组分（A）的含量与上述组分（B）的含量的重量比（A）/（B）在2.0 / 1至3.0 / 1的范围内：（A ）硫酸钡; 和（B）中性二氧化硅。

公开(公告)号：US08686078B2

公开(公告)日：2014-04-01

申请号：US13191942

申请日：2011-07-27

申请人： Masashi Noda ,  Eiji Matsunaga

发明人： Masashi Noda ,  Eiji Matsunaga

IPC分类号： C08K3/30

CPC分类号： C08K3/36 ,  C08K3/30 ,  C08L57/08

摘要： Provided is a rubber composition, which is excellent in fuel permeation resistance, and is capable of achieving improvements in low-temperature embrittlement property and solvent crack property. The rubber composition includes: a fluororubber having a fluorine concentration content of 70 to 71 wt % as a main component; a crosslink-type agent; and the following components (A) and (B), in which: the total content [(A)+(B)] of the above-mentioned components (A) and (B) falls within the range of 17 to 25 parts by weight with respect to 100 parts by weight of the above-mentioned fluororubber; and a weight ratio (A)/(B) of the content of the above-mentioned component (A) to the content of the above-mentioned component (B) falls within the range of 2.0/1 to 3.0/1: (A) barium sulfate; and (B) a neutral silica.

摘要翻译： 提供一种橡胶组合物，其耐燃性渗透性优异，能够实现低温脆性和溶剂裂纹性的提高。 橡胶组合物包括：氟浓度为70〜71重量％的氟橡胶作为主要成分; 交联型试剂; （A）和（B）的组分（A）和（B）的含量，其中：上述组分（A）和（B）的总含量[（A）+（B） 相对于100重量份上述氟橡胶的重量; 上述组分（A）的含量与上述组分（B）的含量的重量比（A）/（B）在2.0 / 1至3.0 / 1的范围内：（A ）硫酸钡; 和（B）中性二氧化硅。

公开(公告)号：US20070074895A1

公开(公告)日：2007-04-05

申请号：US11606682

申请日：2006-11-29

申请人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

发明人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

IPC分类号： H05K1/00 ,  H01K3/10

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0329 ,  H05K2203/0315 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof is disclosed. The printed circuit board manufacturing method includes the steps of: forming inner layer conductor circuits 32A on a core substrate 30; forming a recess part 31 on the core substrate 30; housing, in a recess part 31, a planar capacitor device 20 that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin 43 and conductor metal foil 44 to heat pressurize the same for forming a multi-layer plate; forming via holes 41A for electrically connecting an outer layer conductor circuit 42A to the electrodes 21,22 of the capacitor device 20; forming a conductor layer on them; and forming the outer layer conductor circuits 42A on the surfaces of the multi-layer plate.

摘要翻译： 公开了一种薄并且具有大容量电容器功能的印刷电路板及其制造方法。 印刷电路板制造方法包括以下步骤：在芯基板30上形成内层导体电路32A; 在芯基板30上形成凹部31; 在凹部31中容纳没有树脂模制的平面电容器装置20，并且在共享侧的表面上具有电极; 在绝缘体树脂43和导体金属箔44之间插入它们以对其进行热加压以形成多层板; 形成用于将外层导体电路42A电连接到电容器装置20的电极21,22的通孔41A; 在其上形成导体层; 并在多层板的表面上形成外层导体电路42A。

公开(公告)号：US08720952B2

公开(公告)日：2014-05-13

申请号：US12562466

申请日：2009-09-18

申请人： Eiji Matsunaga

发明人： Eiji Matsunaga

IPC分类号： F16L35/00

CPC分类号： F16L37/0987 ,  F16L2201/10

摘要： A connector includes a female member, and a checking member. The female member has a housing being provided with paired windows. The checking member is assembled outward with and retained onto the housing from the axially perpendicular direction, and has a letter “C”-shaped portion and paired locker protrusions. The locker protrusions have a first locker, a leading-end contact, and an inclined second locker, respectively. The first lockers inhibit an assembly-line worker or robot from pulling the checking member from out of the housing. The leading-end contacts expand the letter “C”-shaped portion diametrically when a male member is inserted into the female member completely. The inclined second lockers inhibit elastic force, which arises in the letter “C”-shaped portion, from removing the checking member from the housing. The housing further has a fitting dent. The checking member's letter “C”-shaped portion has a fitting protrusion that fits into the fitting dent.

摘要翻译： 连接器包括阴构件和检查构件。 阴构件具有设置有成对窗口的壳体。 检查部件从轴向垂直的方向向外组装并保持在壳体上，并且具有字母“C”形部分和成对的储物柜突起。 储物柜突起分别具有第一储物柜，前端接触件和倾斜的第二储物柜。 第一个储物柜禁止装配线工人或机器人将检查构件从外壳拉出。 当阳构件完全插入阴构件时，前端接触件直径扩大字母“C”形部分。 倾斜的第二储物柜抑制字母“C”形部分中产生的弹性力，从而将检查构件从壳体中移出。 外壳还具有配合凹痕。 检查构件的字母“C”形部分具有装配到配件凹部中的配合突起。

公开(公告)号：US20050217893A1

公开(公告)日：2005-10-06

申请号：US11086596

申请日：2005-03-22

申请人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

发明人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

IPC分类号： H01G2/06 ,  H01G4/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0329 ,  H05K2203/0315 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

摘要翻译： 一种薄并且具有大容量电容器功能的印刷电路板及其制造方法。 在一个实施例中，印刷电路板的制造方法包括在芯基板上形成内层导体电路; 在所述芯基板上形成凹部; 在凹部中容纳没有树脂模制的平面电容器装置，并且在共享侧的表面上具有电极; 在绝缘树脂和导体金属箔之间插入相同的材料，对其进行热加压以形成多层板; 形成用于将外层导体电路电连接到电容器装置的电极的通孔; 在其上形成导体层; 以及在多层板的表面上形成外层导体电路。

公开(公告)号：US06195789B1

公开(公告)日：2001-02-27

申请号：US09163418

申请日：1998-09-30

申请人： Eiji Matsunaga

发明人： Eiji Matsunaga

IPC分类号： G06F1710

CPC分类号： H01L27/0207 ,  G06T11/203

摘要： A method for designing a circuit on a spherical shaped semiconductor device using a great circle and a small, which is either parallel or perpendicular to the great circle, to define critical dimensions needed for the circuit. A great-circle-small-circle framework is used that has at least one great circle and one small circle that define a critical dimension on the surface of the sphere.

摘要翻译： 一种使用大圆和小平面或垂直于大圆的小球形半导体器件上的电路设计方法来定义电路所需的临界尺寸。 使用一个大圆圈的小圆框架，其具有至少一个大圆圈和一个小圆圈，用于在球体表面定义关键尺寸。

公开(公告)号：US07230818B2

公开(公告)日：2007-06-12

申请号：US11086596

申请日：2005-03-22

申请人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

发明人： Setsuo Noguchi ,  Kohtaroh Takahashi ,  Eiji Matsunaga ,  Yoshihiko Saiki ,  Satoshi Arai ,  Sadamu Toita

IPC分类号： H01G9/04 ,  H01G9/145

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0329 ,  H05K2203/0315 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

摘要翻译： 一种薄并且具有大容量电容器功能的印刷电路板及其制造方法。 在一个实施例中，印刷电路板的制造方法包括在芯基板上形成内层导体电路; 在所述芯基板上形成凹部; 在凹部中容纳没有树脂模制的平面电容器装置，并且在共享侧的表面上具有电极; 在绝缘树脂和导体金属箔之间插入相同的材料，对其进行热加压以形成多层板; 形成用于将外层导体电路电连接到电容器装置的电极的通孔; 在其上形成导体层; 以及在多层板的表面上形成外层导体电路。

公开(公告)号：US6052517A

公开(公告)日：2000-04-18

申请号：US107875

申请日：1998-06-30

申请人： Eiji Matsunaga ,  Nobuo Takeda

发明人： Eiji Matsunaga ,  Nobuo Takeda

IPC分类号： G06F17/50 ,  G06F17/00 ,  G06F19/00

CPC分类号： G06F17/5068

摘要： A method for designing a circuit on a spherical shaped semiconductor integrated circuit using uniform unit shapes capable of cover the surface of the sphere in a matingly corresponding orientation with adjacent unit shapes. The method includes the steps of designing a circuit within each unit shape selected from various types of unit shape patterns; selecting a predetermined number of those unit shapes from the various types of unit shape patterns; and covering the spherical integrated circuit with the predetermined number of unit shapes. Furthermore, the designer can use the unit shapes to navigate over the surface to accurately determine the location, the position, and surface area remaining.

摘要翻译： 使用均匀单位形状的球形半导体集成电路设计电路的方法，其能够以相邻的单位形状以匹配相应的方向覆盖球体的表面。 该方法包括以下步骤：设计从各种类型的单位形状图案中选择的每个单位形状内的电路; 从各种类型的单位形状图案中选择预定数量的那些单位形状; 并以预定数量的单位形状覆盖球形集成电路。 此外，设计人员可以使用单位形状在表面上导航，以准确地确定剩余的位置，位置和表面积。