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公开(公告)号：US4047982A
公开(公告)日：1977-09-13
申请号：US703367
申请日：1976-07-08
申请人： Masato Sagawa , Takeaki Sakai , Tatsuji Sasaki , Zenzo Henmi
发明人： Masato Sagawa , Takeaki Sakai , Tatsuji Sasaki , Zenzo Henmi
CPC分类号： H01F1/0557 , H01F1/055
摘要： The brittle nature and magnetic properties of the rare earth cobalt magnet are improved by the simultaneous addition of Cu and V. Cu and V are included in amounts of from 0.5 to 6% by weight and from 7 to 19% by weight, respectively. The simultaneous addition enables the rear earth cobalt magnet to be cast in the form of an article. In addition, the simultaneous addition not only improves the mechanical properties of the sintered article, in which form the conventional magnet was available, but also the magnetic properties, such that, for example, the coercive force is increased when the molar ratio of cobalt with respect to rear earth elements is great.
摘要翻译： 稀土钴磁体的脆性和磁特性通过同时添加Cu和V而提高.Cu和V的含量分别为0.5至6重量％和7至19重量％。 同时添加可使后部钴钴磁体以物品的形式被铸造。 此外，同时添加不仅提高了可获得常规磁体形式的烧结制品的机械性能，而且改善了磁性能，使得例如当钴与...的摩尔比时，矫顽力增加 尊重后土元素是伟大的。
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公开(公告)号：US4760240A
公开(公告)日：1988-07-26
申请号：US12156
申请日：1987-02-09
申请人： Tsutomu Iikawa , Takeaki Sakai , Isao Kawamura , Katsuhide Natori , Takeshi Nagai , Shigeki Okamoto
发明人： Tsutomu Iikawa , Takeaki Sakai , Isao Kawamura , Katsuhide Natori , Takeshi Nagai , Shigeki Okamoto
CPC分类号： B23K35/286 , B23K1/0056 , B23K26/32 , B23K2201/34 , B23K2203/10
摘要： A process for laser welding a cover and a casing, each made of aluminum or an aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover and the casing together by pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight, and sealing the cover and the casing hermetically.
摘要翻译： 一种用铝或铝基合金制成的覆盖物和壳体的激光焊接方法，其上镀镍层，形成电子器件的封装，该方法包括以下步骤：在 从而提供孔，通过该孔可以将输入/输出端子和源极端子插入并密封地焊接到壳体上; 在壳体的表面上镀镍层; 将电子设备安装在壳体中并在设备和终端之间形成必要的连接; 并且通过脉冲YAG激光束将盖和壳体焊接在一起，从而形成包含1.5至10.0重量％的镍的焊接区域，并且密封盖和壳体。
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