公开(公告)号：US4173821A

公开(公告)日：1979-11-13

申请号：US827091

申请日：1977-08-23

申请人： Masatoshi Yamamoto ,  Keisuke Makino ,  Kiyomi Suzukawa ,  Souichirou Nakamura ,  Kiyomi Sakai

发明人： Masatoshi Yamamoto ,  Keisuke Makino ,  Kiyomi Suzukawa ,  Souichirou Nakamura ,  Kiyomi Sakai

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  B01J17/00

CPC分类号： H01L24/86 ,  H01L21/56 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y10T29/49004 ,  Y10T29/49121

摘要： In the process of fabrication of semiconductor devices, a lead frame hoop supplied from a supply reel is set forward to successively enter into a series of fabricating steps. After having been subjected to pellet bonding, wire bonding and resin-molding, it is wound up about a take-up reel. Baking step is performed with the lead frame hoop wound on the take-up reel. The lead frame hoop unwound from the take-up reel is cut into separate individual semiconductor device units from one another and the measurement of characteristics and the classification of the thus prepared units are carried out with the positions of the units maintained as they were at the cutting step. Accordingly, the process has a smaller number of steps and therefore the production cost is reduced, and the speed of working is improved.

摘要翻译： 在制造半导体器件的过程中，从供带盘供给的引线框环向前设置以依次进入一系列制造步骤。 在进行颗粒粘合，引线接合和树脂成型之后，将其卷绕在卷绕卷轴上。 烘烤步骤是用引导框架缠绕在卷取卷轴上进行的。 将从卷取卷轴展开的引导框架环彼此切割为独立的单独的半导体器件单元，并且由此将所准备的单元的特性和分类的测量结果按照它们在 切割步骤 因此，该方法具有较少的步骤数，因此降低了生产成本，并提高了加工速度。