公开(公告)号：US06865090B2

公开(公告)日：2005-03-08

申请号：US10127472

申请日：2002-04-23

申请人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

发明人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

IPC分类号： H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H05K1/03

CPC分类号： H03H9/177 ,  H03H9/0514 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1035 ,  Y10T428/24926

摘要： An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.

摘要翻译： 构成电子部件用外涂层基板，在低温下进行煅烧，大大降低成本，同时极大地提高基板的尺寸精度。 电子部件用外涂层基板包括：包含以液相烧结的第一材料层和在第一材料层的烧结温度下未烧结的第二材料层的多层基板。 将第一和第二材料层层压，并在第一材料层的煅烧温度下煅烧。

公开(公告)号：US06448696B2

公开(公告)日：2002-09-10

申请号：US09740914

申请日：2000-12-20

申请人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

发明人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

IPC分类号： H01L4108

CPC分类号： H03H9/177 ,  H03H9/0514 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1035 ,  Y10T428/24926

摘要： An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.

摘要翻译： 构成电子部件用外涂层基板，在低温下进行煅烧，大大降低成本，同时极大地提高基板的尺寸精度。 电子部件用外涂层基板包括：包含以液相烧结的第一材料层和在第一材料层的烧结温度下未烧结的第二材料层的多层基板。 将第一和第二材料层层压，并在第一材料层的煅烧温度下煅烧。

公开(公告)号：US5839178A

公开(公告)日：1998-11-24

申请号：US795701

申请日：1997-02-04

申请人： Ryuhei Yoshida ,  Tsuneo Amano

发明人： Ryuhei Yoshida ,  Tsuneo Amano

IPC分类号： H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H01L41/22

CPC分类号： H03H9/177 ,  H03H9/0528 ,  H03H9/0547 ,  H03H9/1035 ,  Y10T29/42

摘要： Disclosed herein is an energy-trapped type piezoelectric resonator, which comprises a piezoelectric resonance element having a piezoelectric plate and a pair of resonance electrodes formed on opposite major surfaces of the piezoelectric plate to have portions opposed to each other through the piezoelectric plate for defining a resonance part through the opposed portions of the resonance electrodes, a pair of reinforcing members holding both major surfaces of the piezoelectric resonance element to be integrated with the same so as to define a space in a region around the resonance part of the piezoelectric resonance element and not to inhibit the resonance part from vibration, and a pair of terminals, holding the piezoelectric resonance element and the pair of reinforcing members as integrated, electrically connected with the pair of resonance electrodes of the piezoelectric resonance element respectively.

摘要翻译： 本发明公开了一种能量俘获型压电谐振器，其包括压电谐振元件，该压电谐振元件具有压电板和形成在压电板的相对的主表面上的一对谐振电极，以便通过压电板彼此相对的部分， 共振部分通过谐振电极的相对部分，一对加强构件，其将压电谐振元件的两个主表面保持为一体，以便在压电谐振元件的谐振部分周围的区域中限定空间;以及 不抑制共振部分的振动，以及一对端子，分别将压电谐振元件和一对加强件保持一体，与压电谐振元件的一对谐振电极电连接。

公开(公告)号：US06483401B2

公开(公告)日：2002-11-19

申请号：US09728652

申请日：2000-12-01

申请人： Ryuhei Yoshida ,  Tsuneo Amano

发明人： Ryuhei Yoshida ,  Tsuneo Amano

IPC分类号： H03H915

CPC分类号： H03H9/1014 ,  H03H9/177

摘要： A substrate of a case for packaging an electronic component includes a conductive cap bonded to a substrate to cover the electronic component and to tightly seal an enclosed space. The substrate has a substrate body layer, electrodes disposed on the substrate body layer, and a glass ceramic layer disposed on the substrate body layer so as to cover a portion of the electrodes.

摘要翻译： 用于包装电子部件的壳体的基板包括：导电盖，其接合到基板以覆盖电子部件并且密封封闭空间。 基板具有基板主体层，设置在基板主体层上的电极以及设置在基板主体层上以覆盖一部分电极的玻璃陶瓷层。

公开(公告)号：US06246013B1

公开(公告)日：2001-06-12

申请号：US09536973

申请日：2000-03-28

申请人： Ryuhei Yoshida ,  Tsuneo Amano

发明人： Ryuhei Yoshida ,  Tsuneo Amano

IPC分类号： H05K116

CPC分类号： H05K1/182 ,  H03H9/0514 ,  H03H9/0547 ,  H03H9/0557 ,  H03H9/105 ,  H05K3/321

摘要： A surface mounting structure is arranged to minimize a height dimension of an electronic component. A surface mount type electronic component is provided on the surface mounting structure. The surface mount type electronic component includes a piezoelectric component element including an insulating substrate, and a piezo-resonator mounted on a mounting surface of the insulating substrate. The piezoelectric component element is mounted on a printed circuit board, with the mounting surface being arranged to face a surface of the printed circuit board. A recess is formed in the printed circuit board and a portion of the piezoelectric component element is accommodated in the recess. A conductive adhesive is located on external connection electrodes provided on the mounting surface and is firmly attached to circuit patterns on the printed circuit board so that the piezoelectric component element is fixed to the printed circuit board. Further, the external connection electrodes are electrically connected to the circuit patterns.

摘要翻译： 布置表面安装结构以最小化电子部件的高度尺寸。 表面安装型电子部件设置在表面安装结构上。 表面安装型电子部件包括具有绝缘基板的压电元件元件和安装在绝缘基板的安装面上的压电谐振器。 压电元件安装在印刷电路板上，安装表面设置成面对印刷电路板的表面。 在印刷电路板中形成凹部，并且压电元件的一部分容纳在凹部中。 导电粘合剂位于设置在安装表面上的外部连接电极上，并牢固地附着在印刷电路板上的电路图案上，使压电元件固定在印刷电路板上。 此外，外部连接电极电连接到电路图案。