Substrate gripping apparatus, substrate gripping method and substrate releasing method
    5.
    发明申请
    Substrate gripping apparatus, substrate gripping method and substrate releasing method 有权
    基板夹持装置,基板夹持方法和基板释放方法

    公开(公告)号:US20050210669A1

    公开(公告)日:2005-09-29

    申请号:US11090236

    申请日:2005-03-28

    摘要: A robot hand 23 having a hand body 30 having a reference axis J1 is provided with fixed holding members 40 and 41 and a movable holding member 42. The holding members 40, 41 and 42 are arranged on the hand body at angular intervals about the reference axis J1. Each of the fixed holding members 40 and 41 has a first guide part 50 and a second guide part 51 defining a V-shaped groove. The movable holding member 42 has a first guide part 60 and a second guide part 61 defining a V-shaped groove. Peripheral parts 19 of a wafer 22 are fit in the V-shaped grooves of the holding members 40 to 42 to grip the wafer 22 by the robot hand 23. The first guide parts 50 and 61 are provided at their lower ends with protrusions 55 and 65 protruding toward the reference axis J1, respectively. The protrusions 55 and 65 prevent the wafer 22 from slipping off the holding members 40 to 42.

    摘要翻译: 具有参考轴线J 1的手主体30的机器人手23设置有固定保持构件40和41以及可动保持构件42.保持构件40,41和42以围绕 参考轴J 1。 每个固定保持构件40和41具有限定V形槽的第一引导部分50和第二引导部分51。 可动保持构件42具有限定V形槽的第一引导部60和第二引导部61。 将晶片22的周边部件19装配在保持部件40〜42的V字形槽中,以通过机械手23握住晶片22。 第一引导部件50和61在其下端设置有分别朝向参考轴线J 1突出的突起55和65。 突起55和65防止晶片22从保持构件40至42滑落。

    Substrate gripping apparatus, substrate gripping method and substrate releasing method
    6.
    发明授权
    Substrate gripping apparatus, substrate gripping method and substrate releasing method 有权
    基板夹持装置,基板夹持方法和基板释放方法

    公开(公告)号:US07547053B2

    公开(公告)日:2009-06-16

    申请号:US11090236

    申请日:2005-03-28

    IPC分类号: B65G49/07

    摘要: A robot hand 23 having a hand body 30 having a reference axis J1 is provided with fixed holding members 40 and 41 and a movable holding member 42. The holding members 40, 41 and 42 are arranged on the hand body at angular intervals about the reference axis J1. Each of the fixed holding members 40 and 41 has a first guide part 50 and a second guide part 51 defining a V-shaped groove. The movable holding member 42 has a first guide part 60 and a second guide part 61 defining a V-shaped groove. Peripheral parts 19 of a wafer 22 are fit in the V-shaped grooves of the holding members 40 to 42 to grip the wafer 22 by the robot hand 23. The first guide parts 50 and 61 are provided at their lower ends with protrusions 55 and 65 protruding toward the reference axis J1, respectively. The protrusions 55 and 65 prevent the wafer 22 from slipping off the holding members 40 to 42.

    摘要翻译: 具有参考轴线J1的手主体30的机器人手23设置有固定保持构件40和41以及可动保持构件42.保持构件40,41和42以关于参考轴线的角度间隔设置在手柄上 轴J1。 每个固定保持构件40和41具有限定V形槽的第一引导部分50和第二引导部分51。 可动保持构件42具有限定V形槽的第一引导部60和第二引导部61。 晶片22的周边部分19装配在保持构件40至42的V形槽中,以通过机械手23夹紧晶片22.第一引导部分50和61在其下端设置有突起55和 65分别向基准轴J1突出。 突起55和65防止晶片22从保持构件40至42滑落。