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公开(公告)号：US07556669B2
公开(公告)日：2009-07-07
申请号：US11571289
申请日：2005-06-27
IPC分类号： B22F9/00
CPC分类号： B23K35/025 , B22F9/082 , B23K35/0244 , B23K35/30 , B23K35/3013 , C22C1/0466 , H05K3/3484
摘要： The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
摘要翻译： 问题在于提供一种Au-Sn合金粉末，用于生产具有减少的空隙产生的Au-Sn合金焊膏。 该问题由用于焊锡膏的Au-Sn合金粉末来解决，该Sn-Sn合金粉末的组成为Sn为20.5〜23.5质量％，余量为Au和不可避免的杂质，其组织为0.5〜30面积 直径3μm以下的细小的富Sn的初晶相的％的结晶化为基体。
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公开(公告)号：US20070183922A1
公开(公告)日：2007-08-09
申请号：US11571289
申请日：2005-06-27
IPC分类号： C22C5/02
CPC分类号： B23K35/025 , B22F9/082 , B23K35/0244 , B23K35/30 , B23K35/3013 , C22C1/0466 , H05K3/3484
摘要： The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 μm or less are crystallized in a matrix.
摘要翻译： 问题在于提供一种Au-Sn合金粉末，用于生产具有减少的空隙产生的Au-Sn合金焊膏。 该问题由用于焊锡膏的Au-Sn合金粉末来解决，该Sn-Sn合金粉末的组成为Sn为20.5〜23.5质量％，余量为Au和不可避免的杂质，其组织为0.5〜30面积 直径3μm以下的细小的富Sn的初晶相的％的结晶化为基体。
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公开(公告)号：US20050007130A1
公开(公告)日：2005-01-13
申请号：US10902779
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
摘要翻译： 一种探针装置，其具有包括膜的接触探针，形成在所述膜上的多个布线图案，每个布线图案具有从所述膜突出以形成接触针的前端部，以及设置在所述膜上的金属层。 在一个实施例中，接触探针装置包括彼此连接的第一和第二接触探针，第一接触探针包括第一膜和形成在第一膜上的多个第一布线图案，每个第一布线图案具有前端部分 从第一膜突出以形成接触针。 第二接触探针包括第二膜和形成在第二膜上的多个第二布线图案。 多个第二布线图案连接到多个第一布线图案，并且第二接触探针与第一接触探针分开形成。
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公开(公告)号：US06937042B2
公开(公告)日：2005-08-30
申请号：US10902861
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US20050001641A1
公开(公告)日：2005-01-06
申请号：US10902859
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Kato , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Kato , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US06917211B2
公开(公告)日：2005-07-12
申请号：US10903012
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US20050001644A1
公开(公告)日：2005-01-06
申请号：US10903012
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US20050001642A1
公开(公告)日：2005-01-06
申请号：US10902860
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Kato , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Kato , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US06903563B2
公开(公告)日：2005-06-07
申请号：US10902860
申请日：2004-08-02
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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公开(公告)号：US06900647B2
公开(公告)日：2005-05-31
申请号：US10776326
申请日：2004-02-12
申请人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
发明人： Hideaki Yoshida , Toshinori Ishii , Atushi Matsuda , Mituyoshi Ueki , Noriyoshi Tachikawa , Tadashi Nakamura , Naoki Katou , Shou Tai , Hayato Sasaki , Naohumi Iwamoto , Akihumi Mishima , Toshiharu Hiji , Akihiro Masuda
CPC分类号： G01R1/07342
摘要： A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
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