公开(公告)号：US6074442A

公开(公告)日：2000-06-13

申请号：US547107

申请日：1995-10-23

申请人： Masayuki Kobayashi ,  Shigetoshi Shimoyama ,  Nakaji Miura

发明人： Masayuki Kobayashi ,  Shigetoshi Shimoyama ,  Nakaji Miura

IPC分类号： H01L21/673 ,  H01L21/30 ,  H01L21/64 ,  H01L21/68

CPC分类号： H01L21/67303 ,  Y10T29/41

摘要： An method of separating a slice base mounting member such as a carbon member from sliced wafers, and an jig which is used for treating the wafers in the method, are disclosed. The method of separating a slice base mounting member from sliced wafers comprises the steps of; supporting a plurality of wafers having at least a slice base mounting member in a stacked state, and separating the slice base mounting member from the stacked wafers.

摘要翻译： 公开了一种从切片晶片分离诸如碳构件的切片基座安装构件的方法以及用于在该方法中处理晶片的夹具。 从切片晶片分离切片基底安装部件的方法包括以下步骤： 支撑多个晶片，所述多个晶片至少具有层叠状态的切片基底安装部件，并且将切片基部安装部件与堆叠的晶片分离。

公开(公告)号：US5806137A

公开(公告)日：1998-09-15

申请号：US576235

申请日：1995-12-21

申请人： Hiromitsu Ishi ,  Nakaji Miura ,  Masayuki Kobayashi ,  Shigetoshi Shimoyama

发明人： Hiromitsu Ishi ,  Nakaji Miura ,  Masayuki Kobayashi ,  Shigetoshi Shimoyama

IPC分类号： B08B1/02 ,  B08B1/04 ,  H01L21/304 ,  H01L21/306 ,  B08B5/00 ,  B08B11/00

CPC分类号： H01L21/02052 ,  B08B1/007 ,  B08B1/02 ,  B08B1/04

摘要： According to the invention, there is provided a wafer washing and drying apparatus for accurately and reliably effecting the washing of wafers after slicing, mainly the removal of foreign particles attached to the wafer end faces. The apparatus comprises a washing unit including a pluralitys of brush roller pairs for washing wafers, arranged in a row in a wafer conveying direction such that they are rotated in different directions, that is, some of them being rotated in the wafer conveying direction, and the others being rotated in the opposite direction to the wafer conveying direction, their brush bundles being arranged helically in the axial direction, at least tips of the brush hair constituting the brush hair bundles being non-linear, and a drying unit including air stream blow-out nozzles for blowing out air streams upstream with respect to the wafer conveying direction.

摘要翻译： 根据本发明，提供了一种用于在切片之后精确可靠地实现晶片洗涤的晶片洗涤和干燥装置，主要是去除附着到晶片端面的异物。 该装置包括洗涤单元，该洗涤单元包括用于洗涤晶片的多个刷辊对，其沿晶片输送方向排成一列，使得它们沿不同方向旋转，即其中一些辊沿着晶片输送方向旋转，以及 其他的沿与晶片输送方向相反的方向旋转，它们的刷束在轴向方向上螺旋地布置，构成刷毛束的刷毛的至少尖端是非线性的，以及包括气流吹动的干燥单元 - 用于相对于晶片输送方向吹出空气流的喷嘴。

公开(公告)号：US5684599A

公开(公告)日：1997-11-04

申请号：US673477

申请日：1996-07-01

申请人： Shigetoshi Shimoyama ,  Kaneyoshi Aramaki

发明人： Shigetoshi Shimoyama ,  Kaneyoshi Aramaki

IPC分类号： G01B11/02 ,  G01B11/26 ,  H01L21/66 ,  H01L21/68 ,  G01B11/00

CPC分类号： H01L22/12

摘要： An apparatus capable of concurrently measuring the depth and angle of a notch in the peripheral edge of a wafer includes: a unit for rotating the wafer; a wafer edge detector, including a light-emitting unit and a photo-detecting unit arranged to read the shape of the peripheral edge of the wafer, for outputting a wafer edge detecting signal corresponding to the shape of the peripheral edge of the wafer; a wafer rotational angular position detector for detecting the rotational angular position of the wafer being rotated and outputting a wafer rotational angular position detecting signal; and an arithmetical unit for computing the dimensions of the notch from the wafer edge detecting signal and the wafer rotational angular position detecting signal.

摘要翻译： 一种能够同时测量晶片的周缘中的凹口的深度和角度的装置包括：用于旋转晶片的单元; 晶片边缘检测器，包括发光单元和光检测单元，其布置成读取晶片的周边边缘的形状，用于输出与晶片的周边边缘形状对应的晶片边缘检测信号; 晶片旋转角位置检测器，用于检测正在旋转的晶片的旋转角位置并输出晶片旋转角位置检测信号; 以及用于从晶片边缘检测信号和晶片旋转角位置检测信号计算凹口的尺寸的算术单元。