公开(公告)号：US20100178851A1

公开(公告)日：2010-07-15

申请号：US12685793

申请日：2010-01-12

申请人： Masayuki NAKANISHI ,  Kenya Ito ,  Tamami Takahashi ,  Kumiko Miyamoto ,  Kenji Kodera

发明人： Masayuki NAKANISHI ,  Kenya Ito ,  Tamami Takahashi ,  Kumiko Miyamoto ,  Kenji Kodera

IPC分类号： B24B9/06 ,  B24B1/00 ,  B24B21/00

CPC分类号： B24B9/065 ,  B24B21/004

摘要： A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains.

摘要翻译： 用于抛光基板周边的抛光装置包括：基板保持器，其被构造成旋转基板;第一抛光部，其被配置为通过使第一抛光工具的抛光层与基板的周边接触来抛光基板的周边; 当被基板保持器旋转时，以及第二抛光部分，被配置为当第二抛光工具的抛光层与基板保持器旋转时与基板的周边接触，从而抛光基板的周边。 第一研磨工具的抛光层具有硬的第一磨料颗粒，并且第二抛光工具的抛光层具有比第一磨料颗粒更软的第二磨料颗粒。