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公开(公告)号：US08986069B2
公开(公告)日：2015-03-24
申请号：US13459421
申请日：2012-04-30
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。
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公开(公告)号：US08445360B2
公开(公告)日：2013-05-21
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/46 , H01L21/30 , H01L21/78 , H01L21/301
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。
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公开(公告)号：US20120244787A1
公开(公告)日：2012-09-27
申请号：US13308857
申请日：2011-12-01
IPC分类号： B24B21/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板周边部分的下表面。 支撑台与保持台一致地旋转。
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公开(公告)号：US08187055B2
公开(公告)日：2012-05-29
申请号：US12292662
申请日：2008-11-24
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。
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5.发明授权公开(公告)号：US07684436B2
公开(公告)日：2010-03-23
申请号：US10518409
申请日：2003-06-18
IPC分类号： H04J3/22
CPC分类号： H04L67/2819 , H04L29/06 , H04L47/2408 , H04L67/04 , H04L67/26 , H04L67/28 , H04L67/2871 , H04L69/08 , H04L69/329 , H04W4/00 , H04W4/18 , H04W80/04 , H04W88/16
摘要： Various services for a mobile communication network or an IP network are implemented by processing necessary information suitably in accordance with a service type so as to exchange the information to a service control device and transmitting the results of the service process by the service control device to the mobile communication network or the IP network, for a service request from the mobile communication network or the IP network. A gateway device of the present invention retains a signal defining various rules or policies received from the service control device, judges a service type and a destination requested from the service request signal by the various rules or policies for the service request signal transmitted from a communication terminal of the mobile communication network or the communication terminal of the IP network, performs protocol conversion on the service request signal in accordance with the service type, and transmits the service request signal to the corresponding destination.
摘要翻译： 针对移动通信网络或IP网络的各种服务通过根据服务类型适当地处理必要信息来实现，以便将信息交换到服务控制设备，并将服务控制设备的服务处理结果传送到 移动通信网络或IP网络，用于来自移动通信网络或IP网络的服务请求。 本发明的网关装置保存定义从服务控制装置接收的各种规则或策略的信号，通过从通信发送的服务请求信号的各种规则或策略来判断从服务请求信号请求的服务类型和目的地 移动通信网络的终端或IP网络的通信终端，根据服务类型对服务请求信号执行协议转换，并将服务请求信号发送到对应的目的地。
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公开(公告)号：US20090117828A1
公开(公告)日：2009-05-07
申请号：US10581669
申请日：2005-02-23
申请人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
发明人： Akihisa Hongo , Kenya Ito , Kenji Yamaguchi , Masayuki Nakanishi
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002
摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).
摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括用于在其中形成研磨室（2）的壳体（3），用于保持和旋转基底（W）的旋转台（1），用于供应研磨带（5）的研磨带供给机构 ）到抛光室（2）中并供给到抛光室（2），用于将抛光带（5）压靠在基板（W）的斜面部分上的抛光头（35） 将液体供给到所述基板（W）的前表面和后表面;以及调节机构（16），用于使所述研磨室（2）的内部压力被设定为低于所述研磨室 （2）。
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7.发明申请Gateway apparatus, and method for processsing signals in the gateway apparatus 有权网关装置，以及网关装置中处理信号的方法公开(公告)号：US20050226250A1
公开(公告)日：2005-10-13
申请号：US10518409
申请日：2003-06-18
IPC分类号： H04W88/16 , H04L12/66 , H04L12/701 , H04L12/721 , H04L29/06 , H04L29/08 , H04W4/00 , H04W4/16 , H04W4/18 , H04W28/00 , H04W80/04 , H04L12/56
CPC分类号： H04L67/2819 , H04L29/06 , H04L47/2408 , H04L67/04 , H04L67/26 , H04L67/28 , H04L67/2871 , H04L69/08 , H04L69/329 , H04W4/00 , H04W4/18 , H04W80/04 , H04W88/16
摘要： The present invention provides various services for a mobile communication network (100) or an IP network (200), by processing necessary information suitably in accordance with a service type so as to exchange the information to a service control device (20) and transmitting the results of the service process by the service control device (20) to the mobile communication network (100) or the IP network (200), for a service request from the mobile communication network (100) or the IP network (200). A gateway device (10) of the present invention retains a signal defining various rules or policies received from the service control device (20), judges a service type and a destination requested from the service request signal by the various rules or policies for the service request signal transmitted from a communication terminal (300) of the mobile communication network (100) or the communication terminal of the IP network (20), performs protocol conversion on the service request signal in accordance with the service type, and transmits the service request signal to the corresponding destination.
摘要翻译： 本发明通过根据业务类型适当地处理必要信息，为移动通信网（100）或IP网络（200）提供各种业务，以便将信息交换到业务控制设备（20） 对于来自移动通信网络（100）或IP网络（200）的服务请求，业务控制设备（20）向移动通信网络（100）或IP网络（200）的业务处理结果。 本发明的网关装置（10）保存定义从服务控制装置（20）接收的各种规则或策略的信号，通过服务请求信号所要求的服务类型和目的地，通过服务的各种规则或策略 从所述移动通信网络（100）的通信终端（300）或所述IP网络（20）的通信终端发送的请求信号，根据所述服务类型对所述服务请求信号执行协议转换，并且发送所述服务请求 信号到相应的目的地。
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公开(公告)号：US4560900A
公开(公告)日：1985-12-24
申请号：US404496
申请日：1982-08-02
IPC分类号： H01J29/86
CPC分类号： H01J29/867 , H01J29/86
摘要： A cathode ray tube device which comprises an electromagnetic shielding casing, a cathode ray tube held in said casing, an elastic material provided between the casing and cathode ray tube in contact therewith, and a space or porous material formed in part of a region defined between the casing and elastic material, and wherein said space or porous material suppresses the axial shifting of the cathode ray tube resulting from the thermal expansion of the elastic material when it is highly heated.
摘要翻译： 一种阴极射线管装置，包括电磁屏蔽壳体，保持在所述壳体中的阴极射线管，设置在壳体和与其接触的阴极射线管之间的弹性材料，以及形成在区域或多孔材料之间的区域 壳体和弹性材料，并且其中所述空间或多孔材料抑制当高度加热时弹性材料的热膨胀导致的阴极射线管的轴向移动。
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公开(公告)号：US4510062A
公开(公告)日：1985-04-09
申请号：US605570
申请日：1984-04-30
申请人： Masayuki Nakanishi
发明人： Masayuki Nakanishi
CPC分类号： C10M135/22 , C10M2219/082 , C10N2240/00 , C10N2240/22 , C10N2240/30 , C10N2240/50 , C10N2240/52 , C10N2240/54 , C10N2240/56 , C10N2240/58 , C10N2240/60 , C10N2240/66
摘要： A refrigeration oil composition comprising at least one oil selected from the group consisting of mineral oils and synthetic oils, said oil having a viscosity of from 1 to 500 cSt at 40.degree. C.; and a mercaptan of the formula RSH, wherein R is an alkyl group having 14 to 20 carbon atoms, said mercaptan being in an amount of from 5 to 5000 ppm, based on said oil composition, said refrigeration oil has excellent lubrication characteristics and is therefore effective to prevent seizure of sliding portions of the refrigerator mechanism and at the same time inhibits the occurrence of valve coking. It is also stable even in a refrigerant such as Freon and is therefore free from causing corrosion of the sliding portions of the refrigerator.
摘要翻译： 一种包含至少一种选自矿物油和合成油的油的冷冻机油组合物，所述油在40℃下的粘度为1至500cSt; 和式RSH的硫醇，其中R是具有14至20个碳原子的烷基，所述硫醇的量为5至5000ppm，基于所述油组合物，所述冷冻机油具有优异的润滑特性，因此 有效地防止冰箱机构的滑动部分的卡住，并且同时抑制阀焦化的发生。 即使在诸如氟利昂的制冷剂中也是稳定的，因此不会引起冰箱的滑动部分的腐蚀。
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10.发明授权公开(公告)号：US08926402B2
公开(公告)日：2015-01-06
申请号：US13303485
申请日：2011-11-23
申请人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
发明人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
CPC分类号： B24B9/065 , B24B21/002 , B24B37/02
摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.
摘要翻译： 提供了研磨基板周边部分的方法。 该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。 抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。
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