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公开(公告)号：US20100178851A1
公开(公告)日：2010-07-15
申请号：US12685793
申请日：2010-01-12
CPC分类号： B24B9/065 , B24B21/004
摘要： A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains.
摘要翻译： 用于抛光基板周边的抛光装置包括：基板保持器，其被构造成旋转基板;第一抛光部，其被配置为通过使第一抛光工具的抛光层与基板的周边接触来抛光基板的周边; 当被基板保持器旋转时，以及第二抛光部分，被配置为当第二抛光工具的抛光层与基板保持器旋转时与基板的周边接触，从而抛光基板的周边。 第一研磨工具的抛光层具有硬的第一磨料颗粒，并且第二抛光工具的抛光层具有比第一磨料颗粒更软的第二磨料颗粒。
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公开(公告)号：US20110217906A1
公开(公告)日：2011-09-08
申请号：US13036114
申请日：2011-02-28
申请人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
发明人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。
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公开(公告)号：US20110256811A1
公开(公告)日：2011-10-20
申请号：US13080821
申请日：2011-04-06
申请人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/04 , B24B37/042
摘要： A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.
摘要翻译： 抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。 抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。
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公开(公告)号：US20110207294A1
公开(公告)日：2011-08-25
申请号：US13027551
申请日：2011-02-15
申请人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： H01L21/762
CPC分类号： H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
摘要： A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
摘要翻译： 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括：在第一旋转速度旋转器件基板的同时，将第一研磨带压在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板周边部分的沉积膜 并暴露下面的硅; 并且在第二旋转速度旋转所述装置基板的同时将第二研磨带压靠在所述装置基板的周边部分中的暴露的硅上，从而将所述硅抛光至预定的深度。
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公开(公告)号：US20120244787A1
公开(公告)日：2012-09-27
申请号：US13308857
申请日：2011-12-01
IPC分类号： B24B21/06
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/006 , B24B21/008 , B24B21/20
摘要： The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.
摘要翻译： 抛光装置具有能够抛光基板的周边部分以形成直角横截面的抛光单元。 抛光装置包括：保持和旋转衬底的衬底保持器; 支撑抛光带的导辊; 以及抛光头，其具有从上方将研磨带的边缘压靠在基板的周边部分的按压部件。 引导辊布置成使得抛光带平行于基板的切线方向延伸，并且抛光带的抛光表面平行于基板的表面。 基板保持器包括：保持基板的保持台; 以及支撑台，其整体地支撑基板周边部分的下表面。 支撑台与保持台一致地旋转。
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6.发明申请公开(公告)号：US20110136411A1
公开(公告)日：2011-06-09
申请号：US12956381
申请日：2010-11-30
CPC分类号： B24B9/065 , B24B21/002
摘要： A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.
摘要翻译： 提供了一种能够快速抛光由磨削的背面和基板的圆周表面形成的角部，而不会在薄基板上造成损坏的方法。 该方法包括使基板围绕其中心旋转，并且将研磨带压靠在由基板的背面和圆周表面形成的角部上以抛光角部。
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