公开(公告)号：US20180233323A1

公开(公告)日：2018-08-16

申请号：US15896377

申请日：2018-02-14

Applicant: Massachusetts Institute of Technology

Inventor： Michael Patrick Walsh ,  Dirk Robert Englund

IPC: H01J37/28 ,  H01J37/302 ,  H01J37/22

Abstract: A method of locating a substrate within a field of view of an imaging system includes acquiring an image of a first marker on a substrate in the field of view. The first marker has a first spatial pattern representing a position of the first marker relative to the substrate. The method also includes determining possible positions of the substrate based on the first spatial pattern and moving the substrate relative to the field of view based on the possible positions of the substrate. The method also includes acquiring an image of a second marker on the substrate in the field of view. The second marker has a second pattern representing a position of the second marker relative to the substrate. The method further includes determining the position of the substrate relative to the field of view based on the position of the second marker on the substrate.

公开(公告)号：US10522326B2

公开(公告)日：2019-12-31

申请号：US15896377

申请日：2018-02-14

Applicant: Massachusetts Institute of Technology

Inventor： Michael Patrick Walsh ,  Dirk Robert Englund

IPC: H01J37/302 ,  H01L27/146 ,  H01J37/28 ,  H01J37/22 ,  G01N21/00 ,  G02B21/00 ,  H01L21/68 ,  H01L23/544

Abstract: A method of locating a substrate within a field of view of an imaging system includes acquiring an image of a first marker on a substrate in the field of view. The first marker has a first spatial pattern representing a position of the first marker relative to the substrate. The method also includes determining possible positions of the substrate based on the first spatial pattern and moving the substrate relative to the field of view based on the possible positions of the substrate. The method also includes acquiring an image of a second marker on the substrate in the field of view. The second marker has a second pattern representing a position of the second marker relative to the substrate. The method further includes determining the position of the substrate relative to the field of view based on the position of the second marker on the substrate.