公开(公告)号：US08216867B2

公开(公告)日：2012-07-10

申请号：US12482165

申请日：2009-06-10

申请人： Matthew Donofrio ,  Winston T. Parker ,  Michael John Bergmann ,  Steven Scott Gilmore ,  Jay Thomas Norman ,  Kevin Shawne Schneider

发明人： Matthew Donofrio ,  Winston T. Parker ,  Michael John Bergmann ,  Steven Scott Gilmore ,  Jay Thomas Norman ,  Kevin Shawne Schneider

IPC分类号： H01L21/00

CPC分类号： H01L33/0095 ,  H01L33/0079 ,  H01L33/22

摘要： A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.

摘要翻译： 激光刻印发光二极管（LED）晶片以产生激光划线切割。 然后，例如通过湿法蚀刻来清洁晶片，以减少刻划损伤。 然后，在已经被清洁的晶片上形成用于LED的电接触层。 或者，划线切割可以在接触形成之前由多次蚀刻产生。 还描述了相关的LED。

公开(公告)号：US20100314633A1

公开(公告)日：2010-12-16

申请号：US12482165

申请日：2009-06-10

申请人： Matthew Donofrio ,  Winston T. Parker ,  Michael John Bergmann ,  Steven Scott Gilmore ,  Jay Thomas Norman ,  Kevin Shawne Schneider

发明人： Matthew Donofrio ,  Winston T. Parker ,  Michael John Bergmann ,  Steven Scott Gilmore ,  Jay Thomas Norman ,  Kevin Shawne Schneider

IPC分类号： H01L21/78 ,  H01L33/00 ,  H01L21/268

CPC分类号： H01L33/0095 ,  H01L33/0079 ,  H01L33/22

摘要： A wafer of light emitting diodes (LEDs) is laser scribed to produce a laser scribing cut. Then, the wafer is cleaned, for example by wet etching, to reduce scribe damage. Then, electrical contact layers for the LEDs are formed on the wafer that has been cleaned. Alternatively, the scribing cut may be produced by multiple etches before contact formation. Related LEDs are also described.

摘要翻译： 激光刻印发光二极管（LED）晶片以产生激光划线切割。 然后，例如通过湿法蚀刻来清洁晶片，以减少刻划损伤。 然后，在已经被清洁的晶片上形成用于LED的电接触层。 或者，划线切割可以在接触形成之前由多次蚀刻产生。 还描述了相关的LED。