METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC
    1.
    发明申请
    METHODS FOR DISTRIBUTING POWER IN LAYOUT OF IC 有权
    IC分布功率分配方法

    公开(公告)号:US20160217243A1

    公开(公告)日:2016-07-28

    申请号:US14986275

    申请日:2015-12-31

    Applicant: MediaTek Inc.

    CPC classification number: G06F17/5072 G06F17/5009 G06F17/505 G06F2217/78

    Abstract: A method for distributing power in the layout of an integrated circuit is provided. The integrated circuit includes at least one macro block. A first physical layout of the macro block is obtained, wherein the macro block includes a plurality of standard cells. The first physical layout is divided into a plurality of partitions according to an IR simulation result of the first physical layout. A plurality of power isolation cells are inserted between the partitions. A second physical layout is obtained according to the partitions and the power isolation cells. A macro placement of the macro block is obtained according to the second physical layout. Each of the partitions further includes a low drop out (LDO) regulator.

    Abstract translation: 提供了一种用于在集成电路的布局中分配功率的方法。 集成电路包括至少一个宏块。 获得宏块的第一物理布局,其中宏块包括多个标准单元。 根据第一物理布局的IR仿真结果将第一物理布局分成多个分区。 多个电源隔离单元插入分区之间。 根据分区和电源隔离单元获得第二个物理布局。 根据第二物理布局获得宏块的宏放置。 每个分区还包括一个低压降(LDO)调节器。

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