公开(公告)号：US10772228B2

公开(公告)日：2020-09-08

申请号：US15299941

申请日：2016-10-21

Applicant: Medtronic, Inc.

Inventor： John K Day ,  Michael J Nidelkoff ,  Kris A Peterson ,  Andrew J Ries ,  David A Ruben ,  Craig L Wiklund

IPC: H05K5/06 ,  A61J1/00 ,  H01M2/30 ,  H05K5/00 ,  H05K7/14 ,  A61N1/375 ,  A61N1/378

Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.