公开(公告)号：USD1028227S1

公开(公告)日：2024-05-21

申请号：US29740623

申请日：2020-07-06

Applicant: Medtronic, Inc.

Designer： Andrew J. Ries ,  Kamal Deep Mothilal ,  Craig Wiklund ,  Kris A Peterson ,  Hui Jin ,  Kathryn J. Moore

Abstract: FIG. 1 is a front perspective view of a handle for a medical tool according to the present design;
FIG. 2 is front elevation view of the handle for a medical tool of FIG. 1;
FIG. 3 is a rear elevation view of the handle for a medical tool of FIG. 1;
FIG. 4 is a left side view of the handle for a medical tool of FIG. 1;
FIG. 5 is a right side view of the handle for a medical tool of FIG. 1;
FIG. 6 is a top plan view of the handle for a medical tool of FIG. 1;
FIG. 7 is a bottom plan view of the handle for a medical tool of FIG. 1;
FIG. 8 is a rear perspective view of the handle for a medical tool of FIG. 1;
FIG. 9 is cross-sectional view of the handle for a medical tool of FIG. 1 taken in the plane of line 9-9 of FIG. 2, with a cross-sectional view taken in the plane of and in an opposite direction indicated by line 9-9 being a mirror image thereof;
FIG. 10 is a cross-sectional view of the handle for a medical tool of FIG. 1 taken in the plane of line 10-10 of FIG. 4; and,
FIG. 11 is a cross-sectional view of the handle for a medical tool of FIG. 1 taken in the plane of line 11-11 of FIG. 4.
The broken lines in the drawings are for the purpose of illustrating portions of the handle for a medical tool that form no part of the claimed design. Dot-dash lines indicate a transition from claimed subject matter to unclaimed subject matter. Surfaces forming part of the claimed design are defined by shaded surfaces.

公开(公告)号：US10772228B2

公开(公告)日：2020-09-08

申请号：US15299941

申请日：2016-10-21

Applicant: Medtronic, Inc.

Inventor： John K Day ,  Michael J Nidelkoff ,  Kris A Peterson ,  Andrew J Ries ,  David A Ruben ,  Craig L Wiklund

IPC: H05K5/06 ,  A61J1/00 ,  H01M2/30 ,  H05K5/00 ,  H05K7/14 ,  A61N1/375 ,  A61N1/378

Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.