公开(公告)号：US20150045862A1

公开(公告)日：2015-02-12

申请号：US13963103

申请日：2013-08-09

Applicant: Medtronic, Inc.

Inventor： Simon E. Goldman ,  Rajesh V. Iyer ,  Curtis E. Burgardt ,  Zhi Fang ,  Michael J. Galloway ,  Ryan J. Jensen ,  James A. Martin ,  Fabian A. Pena

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  G01R31/1227 ,  G01R31/14 ,  H05K5/0247 ,  Y10T29/49004 ,  Y10T29/49147

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

公开(公告)号：US09643020B2

公开(公告)日：2017-05-09

申请号：US13963103

申请日：2013-08-09

Applicant: Medtronic, Inc.

Inventor： Simon E. Goldman ,  Rajesh V. Iyer ,  Curtis E. Burgardt ,  Zhi Fang ,  Michael J. Galloway ,  Ryan J. Jensen ,  James A. Martin ,  Fabian A. Pena

IPC: A61N1/375 ,  G01R31/12 ,  H05K5/02

CPC classification number: A61N1/3754 ,  G01R31/1227 ,  G01R31/14 ,  H05K5/0247 ,  Y10T29/49004 ,  Y10T29/49147

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

公开(公告)号：US20150045861A1

公开(公告)日：2015-02-12

申请号：US13963069

申请日：2013-08-09

Applicant: Medtronic, Inc.

Inventor： Simon E. Goldman ,  Rajesh V. Iyer ,  Curtis E. Burgardt ,  James A. Martin ,  Laxmi Kanth Peddi ,  William R. Schildgen

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  G01R31/1227 ,  Y10T29/49004

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract translation: 描述了用于可植入医疗装置的制造和组装的方法。 特别地，提供了用于可植入医疗装置的馈通组件的非破坏性电隔离评估的技术。 馈通组件可以包括绝缘结构，延伸穿过绝缘体的多个端子销和具有内腔的套圈，绝缘结构设置在该内腔中。 一个或多个绝缘密封件可以设置在套圈绝缘结构和/或端子销至绝缘结构的界面处。 电隔离评估可以基于馈通组件的部件的介电性质，例如绝缘结构。