公开(公告)号：USD1047136S1

公开(公告)日：2024-10-15

申请号：US29732040

申请日：2020-04-21

Applicant: Medtronic, Inc.

Designer： Thomas J. Fick ,  Michael D. Eggen ,  Jeffrey A. Swanson ,  David B. Engmark ,  Lisa A. Meyer

Abstract: FIG. 1 is front perspective view of the implantable pump controller;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

公开(公告)号：US20230017792A1

公开(公告)日：2023-01-19

申请号：US17378067

申请日：2021-07-16

Applicant: Medtronic, Inc.

Inventor： Kevin Seifert ,  Jonathan A. Hughes ,  Andrei Draghici ,  Lisa A. Meyer ,  Andrew J. Ries ,  Thomas J. Fick

IPC: A61M60/878 ,  H01R24/58 ,  H01R13/22 ,  H01R13/41

Abstract: A connector for a medical device. The connector including an elongate body having a proximal end and a distal end. The connector further including a strut, a plurality of conductors, and a plurality of electrical contacts. The strut being disposed within the elongate body and defining a plurality of channels. Each of the plurality of channels having a proximal end and a distal end opposite the proximal end. The plurality of conductors being disposed within the elongate body and are sized and configured to be received within the plurality of channels and extend between the proximal end and the distal end. The plurality of electrical contacts being coupled to an outer surface of the elongate body and in communication with the plurality of conductors.

公开(公告)号：US20230013106A1

公开(公告)日：2023-01-19

申请号：US17378051

申请日：2021-07-16

Applicant: Medtronic, Inc.

Inventor： Kevin R. Seifert ,  Lisa A. Meyer ,  Ramesh Raghupathy

IPC: A61M60/878 ,  H01R13/46 ,  A61M60/873 ,  A61M60/178 ,  A61M60/216 ,  A61M60/508

Abstract: A header for a controller for an implantable medical device. The header includes at least one bore sized and configured to receive a corresponding connector for the implantable medical device. At least one elongate thermally conducting element is disposed within the header and proximate the at least one bore, the at least one elongate thermally conducting element being configured to conduct heat away from the at least one bore and spread heat within the header when the corresponding connector is received within the at least one bore and is communication with the implantable medical device.